IP Library › Granted Patent US 6,559,033
Granted Patent Utility
US 6,559,033 · Confirmation No. 3451

PROCESS FOR FORMING INTEGRATED CIRCUIT STRUCTURE WITH LOW DIELECTRIC CONSTANT MATERIAL BETWEEN CLOSELY SPACED APART METAL LINES

Patented Case View Patent ↗
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 Code Description Pages PDF
2001-06-27 TRNA Transmittal of New Application 2 View
2001-06-27 SPEC Specification 21 View
2001-06-27 CLM Claims 6 View
2001-06-27 ABST Abstract 1 View
2001-06-27 DRW Drawings-only black and white line drawings 5 View
2001-06-27 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,559,033
App. No.
09/892,250
Filed
2001-06-27
Granted
2003-05-06
Examiner
ANYA, IGWE U
Art Unit
2825
PTA
-55 days