Patent Assignment
Reel/Frame 044886/0001
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2017-12-17
Received: 2017-12-17
Pages: 107
Assignors
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Executed: 2017-12-08
BROADCOM CORPORATION
Executed: 2017-12-08
Assignee
BELL SEMICONDUCTOR, LLC
401 N. MICHIGAN AVE., SUITE 1600, CHICAGO, IL, 60611, UNITED STATES
Covered Applications
(100)
METHOD AND SYSTEM FOR MATCHING QUERY TO ADS USING QUERY SUBWORD VECTORS
App. No. 15/893,424
→
MODULARIZED XML NAMESPACES
App. No. 15/831,077
→
REMOTE PHY IN A BK NODE
App. No. 15/828,904
→
ANTI-TREM2 ANTIBODIES AND METHODS OF USE THEREOF
App. No. 62/558,803
→
SECURITY ADJUSTMENTS IN MOBILE DEVICES
App. No. 15/641,121
→
Response Rules of Trigger Frame
App. No. 15/469,362
→
Decoder Memory Sharing
App. No. 15/467,839
→
MODULARIZED XML NAMESPACES
App. No. 15/076,296
→
STACKED INTERCONNECT HEAT SINK
App. No. 14/678,223
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INTEGRATION OF SHALLOW TRENCH ISOLATION AND THROUGH-SUBSTRATE VIAS INTO INTEGRATED CIRCUIT DESIGNS
App. No. 14/251,258
→
Method and Apparatus for Wide Bandwidth Mixed-Mode Wireless Communications
App. No. 14/094,107
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ALLOTROPIC OR MORPHOLOGIC CHANGE IN SILICON INDUCED BY ELECTROMAGNETIC RADIATION FOR RESISTANCE TURNING OF INTEGRATED CIRCUITS
App. No. 14/073,526
→
Adaptive Infinite Impulse Response (IIR)-Based Code Detection for Symbol-Level Equalizer
App. No. 14/062,554
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IQ IMBALANCE ESTIMATION USING BROADCAST SIGNALS
App. No. 14/050,922
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Idle mode power consumption reduction in wireless communications
App. No. 13/947,182
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LOW POWER PROTOCOL FOR WIRELESS TERMINAL PEER-TO-PEER COMMUNICATIONS
App. No. 13/931,136
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STACKED INTERCONNECT HEAT SINK
App. No. 13/921,707
→
METHOD AND SYSTEM FOR FRAME FORMATS FOR MIMO CHANNEL MEASUREMENT EXCHANGE
App. No. 13/856,708
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CHANNEL TRAFFIC CONGESTION AVOIDANCE IN A MOBILE COMMUNICATION SYSTEM
App. No. 13/781,869
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METHOD FOR HEAT DISSIPATION ON SEMICONDUCTOR DEVICE
App. No. 13/775,922
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SOLDER INTERCONNECT BY ADDITION OF COPPER
App. No. 13/752,524
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FEEDBACK OF CHANNEL INFORMATION IN A CLOSED LOOP BEAMFORMING WIRELESS COMMUNICATION SYSTEM
App. No. 13/729,881
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Maskless Vortex Phase Shift Optical Direct Write Lithography
App. No. 13/722,648
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Enhanced Higher Priority Public Land Mobile Network (HPPLMN) Search
App. No. 13/706,009
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SYSTEM AND METHOD FOR A KRYLOV METHOD SYMBOL EQUALIZER
App. No. 13/680,455
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METHOD OF MANUFACTURING AN ELECTRONIC DEVICE PACKAGE
App. No. 13/677,547
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METHOD AND SYSTEM FOR INTERFERENCE SUPPRESSION IN WCDMA SYSTEMS
App. No. 13/588,297
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LOW POWER PROTOCOL FOR WIRELESS TERMINAL PEER-TO-PEER COMMUNICATIONS
App. No. 13/534,538
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Methods and Systems for Pre-Emphasis of an Envelope Tracking Power Amplifier Supply Voltage
App. No. 13/492,279
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METHOD AND APPARATUS FOR DUAL FREQUENCY TIMING ACQUISITION FOR COMPRESSED WCDMA COMMUNICATION NETWORKS
App. No. 13/489,169
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Cordless Telephone With Digital Audio Player Capability
App. No. 13/472,780
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SYSTEM AND METHOD FOR CONSERVING BATTERY POWER IN A MOBILE STATION
App. No. 13/472,940
→
INPUT/OUTPUT CORE DESIGN AND METHOD OF MANUFACTURE THEREFOR
App. No. 13/443,691
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METAL-OXIDE-SEMICONDUCTOR DEVICE HAVING TRENCHED DIFFUSION REGION AND METHOD OF FORMING SAME
App. No. 13/428,540
→
Methods and Systems for Pre-Emphasis of an Envelope Tracking Power Amplifier Supply Voltage
App. No. 61/611,718
→
Method and Apparatus for Channel Traffic Congestion Avoidance in a Mobile Communication System
App. No. 13/418,967
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PORTABLE CELL PHONE AND A PROIMITY REGULATION SYSTEM FOR USE WITH A PORTABLE CELL PHONE
App. No. 13/398,656
→
CIRCUITS AND METHODS FOR IMPROVED FET MATCHING
App. No. 13/368,985
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BIPOLAR JUNCTION TRANSISTOR HAVING A HIGH GERMANIUM CONCENTRATION IN A SILICON-GERMANIUM LAYER AND A METHOD FOR FORMING THE BIPOLAR JUNCTION TRANSISTOR
App. No. 13/348,415
→
SEMICONDUCTOR DEVICE AND PROCESS FOR REDUCING DAMAGING BREAKDOWN IN GATE DIELECTRICS
App. No. 13/311,299
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MASKLESS VORTEX PHASE SHIFT OPTICAL DIRECT WRITE LITHOGRAPHY
App. No. 13/253,554
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METHODS FOR AVOIDING PARASITIC CAPACITANCE IN AN INTEGRATED CIRCUIT PACKAGE
App. No. 13/252,632
→
BIPOLAR DEVICE HAVING BURIED CONTACTS
App. No. 13/222,877
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LOW-COST 3D FACE-TO-FACE OUT ASSEMBLY
App. No. 13/217,857
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BACKWARD-COMPATIBLE LONG TRAINING SEQUENCES FOR WIRELESS COMMUNICATION NETWORKS
App. No. 13/196,082
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ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURE
App. No. 13/174,970
→
HIGH VOLTAGE TOLERANT METAL-OXIDE-SEMICONDUCTOR DEVICE
App. No. 13/149,122
→
I/O AND POWER ESD PROTECTION CIRCUITS BY ENHANCING SUBSTRATE-BIAS IN DEEP-SUBMICRON CMOS PROCESS
App. No. 13/110,581
→
METHOD AND SYSTEM FOR FRAME FORMATS FOR MIMO CHANNEL MEASUREMENT EXCHANGE
App. No. 13/100,014
→
CORDLESS TELEPHONE WITH DIGITAL AUDIO PLAYER CAPABILITY
App. No. 13/096,420
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SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURE THEREFORE
App. No. 13/093,032
→
METHOD AND APPARATUS FOR WIDE BANDWIDTH MIXED-MODE WIRELESS COMMUNICATIONS
App. No. 13/069,108
→
ALLOTROPIC OR MORPHOLOGIC CHANGE IN SILICON INDUCED BY ELECTROMAGNETIC RADIATION FOR RESISTANCE TURNING OF INTEGRATED CIRCUITS
App. No. 13/119,005
→
LOGIC-BASED EDRAM USING LOCAL INTERCONNECTS TO REDUCE IMPACT OF EXTENSION CONTACT PARASITICS
App. No. 13/046,973
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CONTROLLING WARPING IN INTEGRATED CIRCUIT DEVICES
App. No. 13/041,674
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DECOUPLING CAPACITOR
App. No. 13/032,429
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Method and Apparatus for Channel Traffic Congestion Avoidance in a Mobile Communication System
App. No. 13/031,355
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MITIGATION OF WHISKERS IN SN-FILMS
App. No. 13/059,502
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Prioritizing RACH Message Contents
App. No. 13/026,512
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MULTIPLE DOPING LEVEL BIPOLAR JUNCTIONS TRANSISTORS AND METHOD FOR FORMING
App. No. 13/026,528
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METHOD OF FABRICATION OF THROUGH-SUBSTRATE VIAS
App. No. 12/969,836
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INTEGRATION OF SHALLOW TRENCH ISOLATION AND THROUGH-SUBSTRATE VIAS INTO INTEGRATED CIRCUIT DESIGNS
App. No. 12/969,852
→
MITIGATION OF DETRIMENTAL BREAKDOWN OF A HIGH DIELECTRIC CONSTANT METAL-INSULATOR-METAL CAPACITOR IN A CAPACITOR BANK
App. No. 12/953,624
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INPUT/OUTPUT CORE DESIGN AND METHOD OF MANUFACTURE THEREFOR
App. No. 12/947,948
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EFFICIENT POWER MANAGEMENT METHOD IN INTEGRATED CIRCUIT THROUGH A NANOTUBE STRUCTURE
App. No. 12/912,791
→
Digitally Obtaining Contours of Fabricated Polygons
App. No. 12/890,336
→
HYBRID BUMP CAPACITOR
App. No. 12/885,722
→
STACKED INTERCONNECT HEAT SINK
App. No. 12/840,016
→
DEFECTIVITY-IMMUNE TECHNIQUE OF IMPLEMENTING MIM-BASED DECOUPLING CAPACITORS
App. No. 12/839,148
→
CHIP IDENTIFICATION USING TOP METAL LAYER
App. No. 12/741,839
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THERMALLY STABLE BICMOS FABRICATION METHOD AND BIPOLAR JUNCTION TRNASISTORS FORMED ACCORDING TO THE METHOD
App. No. 12/832,110
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METHOD AND SYSTEM FOR AUTOMATICALLY RESCALING AN ACCUMULATION BUFFER IN SYNCHRONIZATION SYSTEMS
App. No. 12/768,415
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DIELECTRIC BARRIER LAYER FOR INCREASING ELECTROMIGRATION LIFETIMES IN COPPER INTERCONNECT STRUCTURES
App. No. 12/764,004
→
METHOD AND SYSTEM FOR AN ADAPTIVE VBLAST RECEIVER FOR WIRELESS MULTIPLE INPUT MULTIPLE OUTOUT (MIMO) DETECTION
App. No. 12/763,670
→
INTERLEAVING IN A WIRELESS COMMUNICATION SYSTEM
App. No. 12/748,722
→
METHOD TO REDUCE TRENCH CAPACITOR LEAKAGE FOR RANDOM ACCESS MEMORY DEVICE
App. No. 12/680,017
→
BIPOLAR JUNCTION TRANSISTOR HAVING A HIGH GERMANIUM CONCENTRATION IN A SILICON-GERMANIUM LAYER AND A METHOD FOR FORMING THE BIPOLAR JUNCTION TRANSISTOR
App. No. 12/728,412
→
MULTIPLE DOPING LEVEL BIPOLAR JUNCTIONS TRANSISTORS AND METHOD FOR FORMING
App. No. 12/727,304
→
BOND PAD SUPPORT STRUCTURE FOR SEMICONDUCTOR DEVICE
App. No. 12/678,405
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METHOD AND SYSTEM FOR TRANSMITTER BEAMFORMING FOR REDUCED COMPLEXITY MULTIPLE INPUT MULTIPLE OUTPUT (MIMO) TRANSCEIVERS
App. No. 12/724,134
→
METHOD AND SYSTEM FOR MINIMIZING EFFECTS OF TRANSMITTER IMPAIRMENTS IN MULTIPLE INPUT MULTIPLE OUTPUT (MIMO) BEAMFORMING COMMUNICATION SYSTEMS
App. No. 12/706,042
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INTEGRATING A DIGITAL ENCODED-AUDIO BIT STREAM PLAYER IN A RADIO-FREQUENCY TELEPHONE HANDSET
App. No. 12/706,047
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METHOD AND ARTICLE OF MANUFACTURE FOR WIRE BONDING WITH STAGGERED DIFFERENTIAL WIRE BOND PAIRS
App. No. 12/692,209
→
TRANSISTOR FABRICATION METHOD
App. No. 12/689,749
→
INTEGRATED HEAT SINK
App. No. 12/689,806
→
BACKWARD-COMPATIBLE LONG TRAINING SEQUENCES FOR WIRELESS COMMUNICATION NETWORKS
App. No. 12/684,650
→
BIPOLAR DEVICE HAVING IMPROVED CAPACITANCE
App. No. 12/652,560
→
SEMICONDUCTOR PACKAGE AND METHOD USING ISOLATED VSS PLANE TO ACCOMMODATE HIGH SPEED CIRCUITRY GROUND ISOLATION
App. No. 12/625,457
→
METHOD FOR SEPARATING A SEMICONDUCTOR WAFER INTO INDIVIDUAL SEMICONDUCTOR DIES USING AN IMPLANTED IMPURITY
App. No. 12/618,936
→
INTERDIGITATED CAPACITORS
App. No. 12/616,050
→
STRUCTURE AND FABRICATION METHOD FOR CAPACITORS INTEGRATIBLE WITH VERTICAL REPLACEMENT GATE TRANSISTORS
App. No. 12/610,733
→
METHOD AND SYSTEM FOR INTERFERENCE SUPPRESSION IN WCDMA SYSTEMS
App. No. 12/582,771
→
METHOD AND SYSTEM FOR CONTINUOUS PACKET CONNECTIVITY
App. No. 12/577,080
→
METHOD CHARACTERIZING MATERIALS FOR A TRENCH ISOLATION STRUCTURE HAVING LOW TRENCH PARASITIC CAPACITANCE
App. No. 12/574,426
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BI-AXIAL TEXTURING OF HIGH-K DIELECTRIC FILMS TO REDUCE LEAKAGE CURRENTS
App. No. 12/574,479
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METHOD OF MANUFACTURING A LATERALLY DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE
App. No. 12/555,082
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METHOD AND APPARATUS FOR WIDE BANDWIDTH MIXED-MODE WIRELESS COMMUNICATIONS
App. No. 12/553,281
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DIELECTRIC ETCHING
App. No. 12/546,855
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CONTROLLING WARPING IN INTEGRATED CIRCUIT DEVICES
App. No. 12/546,083
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WHISKER-FREE LEAD FRAMES
App. No. 12/462,069
→