IP Library Granted Patent US 8,653,357
Granted Patent B2
US 8,653,357 · App. 13/775,922 · Granted Feb 18, 2014

Method for heat dissipation on semiconductor device

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Quick Facts
Patent No.
US 8,653,357
App. No.
13/775,922
Granted
Feb 18, 2014
Kind
B2
Abstract

A device and method wherein a thermo electric generator device is disposed between stacks of a multiple level device, or is provided on or under a die of a package and is conductively connected to the package. The thermo electric generator device is configured to generate a voltage by converting heat into electric power. The voltage which is generated by the thermo electric generator can be recycled back into the die itself, or to a higher-level unit in the system, even to a cooling fan.

Claims (4)

1. A method of converting heat into electric power, said method comprising: providing a thermoelectric generator device which comprises: a top layer; a bottom layer; a first electrical conductor, thermal insulator layer in contact with said top layer; a second electrical conductor, thermal insulator layer in contact with said bottom layer wherein both the first and second electrical conductor, thermal insulator layers are disposed between said top and bottom layers; a p-type material between the first and second electrical conductor, thermal insulator layers; an n-type material between the first and second electrical conductor, thermal insulator layers; and an electrical and thermal insulating layer between the p-type material and the n-type material, wherein a first end of said electrical and thermal insulating layer between the p-type material and the n-type material contacts the first electrical conductor, thermal insulator layer and does not contact the top layer, and wherein a second end of said electrical and thermal insulating layer between the p-type material and the n-type material contacts the second electrical conductor, thermal insulator layer as well as the bottom layer, thereby providing an electrical separation within the second electrical conductor, thermal insulator layer, wherein each of said top and bottom layers comprise an electrical insulator, thermal conductor layer which is non-electrically conductively contactable with a device; and using said thermoelectric generator device to covert heat generated by the thermoelectric generator device into electric power.

2. A method as recited in claim 1 , further comprising providing that the bottom layer of the thermoelectric generator device is in contact with a die.

3. A method as recited in claim 1 , further comprising providing that the top layer of the thermoelectric generator device is in contact with a die, and the bottom layer of the thermoelectric generator device is in contact with a package.

4. A method as recited in claim 1 , further comprising sandwiching the thermoelectric generator device between two layers of a multiple layer device.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059723/0382 →
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059720/0719 →
SECURITY INTEREST Recorded Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0766 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0608 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2013
From: PRATHER, ZACHARY A.; REDER, STEVEN E.; BERMAN, MICHAEL J.
To: LSI CORPORATION
Reel/Frame 029869/0137 →