Method and article of manufacture for wire bonding with staggered differential wire bond pairs
View Patent ↗A method and article of manufacture for performing wire-bonding operations in an integrated circuit. In one aspect, the operations include the steps of bonding a wire to a first bond site in the integrated circuit and terminating the wire at a second bond site. The bonding and terminating steps are repeated for at least two differential wire bond pairs, and proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles.
1. A method for performing a wire-bonding operation in an integrated circuit, utilizing a bonding tool, the method comprising the steps of:
bonding a wire to a first bond site in the integrated circuit; and
terminating the wire at a second bond site;
wherein the bonding and terminating steps are repeated for at least two differential wire bond pairs, wherein individual wires within each of the at least two differential wire bond pairs have substantially similar wire bond profiles, and wherein proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles. and
wherein individual wires within each of the at least two differential wire bond pairs are adjacent to each other without other wires therebetween in a plan view of the integrated circuit.
2. The method of claim 1 , wherein the step of bonding a wire to a first bond site comprises the step of bonding a wire to a die of the integrated circuit.
3. The method of claim 1 , wherein the step of terminating a wire at a second bond site comprises the step of terminating a wire at an integrated circuit package substrate.
4. The method of claim 3 , wherein the step of terminating the wire at an integrated circuit package substrate comprises the step of terminating the wire at a substrate on which one or more circuit elements are disposed, and to which the at least two differential wire bond pairs are terminated.
5. The method of claim 1 , wherein a first differential wire bond pair of the at least two differential wire bond pairs comprises data signal input wire bonds, and a second differential wire bond pair of the at least two differential wire bond pairs comprises data signal output wire bonds.
6. The method of claim 1 , wherein the proximate differential wire bond pairs have wire bond profiles with different heights above the first bond site in the integrated circuit.
7. The method of claim 1 , wherein the proximate differential wire bond pairs have wire bond profiles with different lengths from the first bond site in the integrated circuit.
8. The method of claim 1 , wherein the at least two differential wire bond pairs are staggered in length from the first bond site in the plan view of the integrated circuit.
9. The method of claim 1 , wherein the bonding and terminating steps are repeated for differential wire bond pairs having a first wire bond profile, then repeated for differential wire bond pairs having a second wire bond profile.
10. The method of claim 1 , wherein the proximate differential wire bond pairs have wire bond profiles with three segments.
11. The method of claim 1 wherein the proximate differential wire bond pairs have wire bond profiles with a continuous curve.
12. The method of claim 1 , wherein either the first bond sites or the second bond sites are bonded to a common die.
13. The method of claim 1 , wherein the bonding tool does not contact existing wire bonds in the bonding operation and wherein wire bonds are configured so that they are not in contact with one another.
14. An article of manufacture for performing a wire-bonding operation in an integrated circuit, utilizing a bonding tool, comprising a machine readable medium containing one or more programs which when executed implement the steps of:
bonding a wire to a first bond site in the integrated circuit; and
terminating the wire at a second bond site;
wherein the bonding and terminating steps are repeated for at least two differential wire bond pairs, wherein individual wires within each of the at least two differential wire bond pairs have substantially similar wire bond profiles, and wherein proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles; and
wherein individual wires within each of the at least two differential wire bond pairs are adjacent to each other without other wires therebetween in a plan view of the integrated circuit.
15. The article of manufacture of claim 14 , wherein the proximate differential wire bond pairs have wire bond profiles with different heights above the first bond site in the integrated circuit.
16. The article of manufacture of claim 14 , wherein the proximate differential wire bond pairs have wire bond profiles with different lengths from the first bond site in the integrated circuit.
17. The method of claim 1 , wherein the at least two differential wire bond pairs provide connections with a substrate for at least one of one or more circuit elements disposed on the substrate.
18. The article of manufacture of claim 14 , wherein the at least two differential wire bond pairs provide connections with a substrate for at least one of one or more circuit elements disposed on the substrate.
19. The article of manufacture of claim 14 , wherein the at least two differential wire bond pairs are staggered in length from the first bond site in the plan view of the integrated circuit.
20. The article of manufacture of claim 14 , wherein either the first bond sites or the second bond sites are bonded to a common die.