Stacked interconnect heat sink
A heat spreader that is configured to be attached to an integrated circuit substrate. The heat spreader includes a thermally conductive core and a heat spreader via that passes through the thermally conductive core. A connection point of the thermally conductive core is configured to form a solder connection to an integrated circuit substrate plug.
1. A heat spreader configured to be attached to an electronic device substrate, comprising:
a thermally conductive core;
a heat spreader via passing through said thermally conductive core; and
a connection point of said thermally conductive core configured to form a solder connection to an integrated circuit substrate plug.
2. The heat spreader as recited in claim 1 , wherein said thermally conductive core is an electrically conductive layer.
3. The heat spreader as recited in claim 2 , further comprising a dielectric layer located between said thermally conductive core and said heat spreader via.
4. The heat spreader as recited in claim 2 , further comprising a solder pad formed on a surface of said electrically conductive layer and configured to form a metallurgical connection to a solder ball.
5. The heat spreader as recited in claim 1 , wherein said thermally conductive core is an electrically insulating layer.
6. The heat spreader as recited in claim 5 , further comprising a heat spreader plug configured to form a metallurgical connection to a solder ball.
7. The heat spreader as recited in claim 1 , where said thermally conductive core is in thermal contact with a device package configured to conduct heat therefrom.