Patent Assignment
Reel/Frame 011990/0024
Assignment of Assignor's Interest
Recorded: 2001-07-18
Pages: 3
Assignee
INCEP TECHNOLOGIES, INC.
SUITE 308, 10650 TREENA STREET, SAN DIEGO, CALIFORNIA, 92131
Covered Property
(1)
Inter-circuit encapsulated packaging
Application:
09/818,173 →
Publication:
US 2002/0008963