IP Library Assignment 012020/0409
Patent Assignment
Reel/Frame 012020/0409

Assignment of Assignor's Interest

Recorded: 2001-07-25 Pages: 4
Assignors
OKA, TAKAHIRO
Executed: 2001-07-13
TERUI, MAKOTO
Executed: 2001-07-13
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
MINATO-KU, 7-12 TORANOMON 1-CHOME, TOKYO, JAPAN
Covered Property (1)
Semiconductor Chip Package
Patent: 7,075,177 →
Application: 09/912,064 →
Publication: US 2002/0105067
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Dec 4, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022043/0739 →
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →