IP Library Assignment 022043/0739
Patent Assignment
Reel/Frame 022043/0739

Change of Name

Recorded: 2008-12-04 Received: 2008-12-23 Pages: 7
Assignor
OKI ELECTRIC INDUSTRY CO., LTD.
Executed: 2008-10-01
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO, HACHIOUJI-SHI, TOKYO, JPX, 193-8550, JAPAN
Covered Properties (96)
Sealing Apparatus for Semiconductor Wafer, Mold of Sealing Apparatus, and Semiconductor Wafer
Application: 11/878,927 →
Semiconductor Apparatus with Decoupling Capacitor
Application: 11/700,100 →
Semiconductor device having low parasitic resistance and small junction leakage characteristic
Application: 11/367,575 →
Divider Circuit and Oscillating Circuit Including the Same
Application: 11/248,316 →
Semiconductor Device for Supplying External Power Supply Voltages to Three Circuit Blocks Including Usb Controller and I/O Block
Application: 11/231,824 →
Semiconductor Chip Package
Application: 11/128,306 →
Method of Making a Semiconductor Device Manufacturing Mask Substrate
Application: 11/101,396 →
Semiconductor Device Having Conductive Interconnections and Porous and Nonporous Insulating Portions
Application: 11/042,033 →
Semiconductor Device
Application: 11/018,250 →
Alignment Mark Structure
Application: 11/004,105 →
Semiconductor Apparatus with Decoupling Capacitor
Application: 10/954,588 →
Video Signal Processing Method for Digital Video Decoder
Application: 10/927,020 →
Method of Manufacturing Semiconductor Device and Semiconductor Device
Application: 10/913,430 →
Rearrangemet Sheet, Semiconductor Device and Method of Manufacturing Thereof
Application: 10/866,697 →
Evaluating Pattern for Measuring and Erosion of a Semiconductor Wafer Polished by a Chemical Mechanical Polishing
Application: 10/834,063 →
Semiconductor Device with Reduced Interconnection Capacity
Application: 10/833,190 →
Level Shift Circuit
Application: 10/792,087 →
Driving Apparatus of a Light-Emitting Device
Application: 10/773,336 →
Semiconductor Apparatus with Decoupling Capacitor
Application: 10/757,467 →
Start-Up Circuit
Application: 10/745,685 →
Sealing Apparatus for Semiconductor Wafer, Mold of Sealing Apparatus, and Semiconductor Wafer
Application: 10/727,662 →
Semiconductor Memory and Its Driving Method
Application: 10/715,524 →
Method of Manufacturing Alignment Mark and Aligning Method Using the Same
Application: 10/700,565 →
Surface Acoustic Wave Filter with Attenuation Poles
Application: 10/668,379 →
Test Method of Memory Ic Function on Device Board with Dynamic Competing Cycle
Application: 10/668,252 →
Semiconductor Device with Elongated Interconnecting Member and Fabrication Method Thereof
Application: 10/460,235 →
Divider Circuit and Oscillating Circuit Including the Same
Application: 10/341,413 →
Semiconductor Memory and Its Driving Method
Application: 10/290,188 →
Semiconductor device with a ferroelectric memory provided on a semiconductor substrate
Application: 10/284,188 →
Surface Acoustic Wave Filter
Application: 10/273,888 →
Evaluating Pattern for Measuring an Erosion of a Semiconductor Wafer Polished by a Chemical Mechanical Polishing
Application: 10/254,645 →
Start-Up Circuit
Application: 10/252,682 →
Semiconductor Device Manufacturing Mask Substrate and Semiconductor Device Manufacturing Method
Application: 10/212,165 →
Voltage-Controlled Oscillation Circuit
Application: 10/212,168 →
Method for Forming Isolation Regions on Semiconductor Device
Application: 10/211,360 →
Semiconductor Apparatus with Decoupling Capacitor
Application: 10/211,365 →
Method and Apparatus for Performing Baking Treatment to Semiconductor Wafer
Application: 10/197,598 →
Dynamic Random Access Memory with Low Power Consumption
Application: 10/175,859 →
Semiconductor Device with Elongated Interconnecting Member and Fabrication Method Thereof
Application: 10/166,182 →
Calculating Apparatus and Its Method
Application: 10/166,178 →
Method of Manufacturing a Semiconductor Device
Application: 10/154,825 →
Method of Manufacturing a Laser Impression on a Low Thermal Conductivity Layer of a Semiconductor Device
Application: 10/151,156 →
Protection Transistor with Improved Edge Structure
Application: 10/140,075 →
Memory Control Circuit Outputting Contents of a Control Register
Application: 10/119,122 →
Alignment Mark Structure
Application: 10/119,320 →
Power Saving Integrated Circuit and Method of Controlling the Same
Application: 10/112,759 →
Semiconductor Device
Application: 10/108,357 →
Method of Manufacturing a Silicon-on-Insulator (Soi) Semiconductor Device
Application: 10/092,499 →
Read-Only Nonvolatile Memory
Application: 10/077,957 →
Method of Manufacturing a Semiconductor Device Including Etching of a Peripheral Area Before Chemical-Mechanical Polishing
Application: 10/062,505 →
Signal Compensation Circuit and Demodulating Circuit with High-Speed and Low-Speed Feedback Loops
Application: 10/061,302 →
Ferroelectric Memory Device Including a Controller
Application: 10/056,206 →
Microcontroller Performing Safe Recovery from Standby Mode
Application: 10/045,101 →
Power-On Reset Circuit
Application: 10/038,912 →
Method of Manufacturing Alignment Mark
Application: 10/034,108 →
Modulator and Oscillator for Microwave and Milliwave Use
Application: 10/020,187 →
Semiconductor Device
Application: 10/020,153 →
Method of Manufacturing Ferroelectric Capacitor
Application: 10/013,691 →
Output Buffer Circuit
Application: 09/996,754 →
Wiring Structure for Transmission Line Having Grooved Conductors
Application: 09/988,017 →
Driving Circuit for Lcd
Application: 09/987,754 →
Power Supply Control Circuit and Lsi Using the Same
Application: 09/983,789 →
Semiconductor Device
Application: 09/977,491 →
Semiconductor Device
Application: 09/977,490 →
Data Transfer Control Circuit with Interrupt Status Register
Application: 09/975,323 →
System for Separating and Recovering Waste Fluid and Spin Coater
Application: 09/968,629 →
A Semiconductor Intergrated Circuit Having Switching Transistors and Varactors
Application: 09/963,500 →
Semiconductor device having silicide layer completely occupied amorphous layer formed in the substrate and an inferface junction of (111) silicon plane
Application: 09/962,119 →
Semiconductor Device and Method for Manufacturing the Same
Application: 09/956,461 →
Semiconductor Memory Device
Application: 09/956,457 →
Supplying Multiple Voltages via Three Power Supply Terminals to a Semiconductor Device That Is Connectable to a Host Device and a Peripheral Device
Application: 09/946,512 →
Semiconductor Memory and Its Driving Method
Application: 09/943,513 →
Manufacturing Method of Semiconductor Device
Application: 09/942,224 →
Heat Treatment Equipment for Object to Be Treated and Its Exhausting Method
Application: 09/938,318 →
Rearrangement Sheet, Semiconductor Device and Method of Manufacturing Thereof
Application: 09/930,710 →
Semiconductor Chip Package
Application: 09/912,064 →
Bonding Pad, Semiconductor Device and Wire Bonding Method
Application: 09/910,953 →
Dynamic Random Access Memory with Low Power Consumption
Application: 09/907,449 →
Polishing Apparatus Having a Dresser and Dresser Adjusting Method
Application: 09/906,799 →
Semiconductor Circuit Device Having Power and Ground Lines Adapted for High-Frequency Operation
Application: 09/900,960 →
Method for Fabricating a Semiconductor Device
Application: 09/899,175 →
Semiconductor Device and Method for Fabricating the Device
Application: 09/898,082 →
Receiving Circuit
Application: 09/894,533 →
Method and Apparatus for Polishing Semiconductor Wafer
Application: 09/894,886 →
Video Signal Processing Apparatus for Digital Video Decoder
Application: 09/875,292 →
Method for Forming Isolation Regions on Semiconductor Device
Application: 09/874,223 →
Method of Manufacturing Semiconductor Device That Protect Interconnect Wirings During Processing of Back Substrate Surface
Application: 09/866,815 →
Method of Fabricating Semiconductor Device Equipped with Capacitor Portion
Application: 09/848,235 →
Method for Forming Isolation Regions on Semiconductor Device
Application: 09/847,274 →
Semiconductor Device
Application: 09/834,882 →
Composite Video Signal Decoder Having Stripe Component Judging Section
Application: 09/829,940 →
Semiconductor Apparatus with Decoupling Capacitor
Application: 09/827,246 →
Reproducing Apparatus
Application: 09/810,445 →
Evaluating Pattern for Measuring an Erosion of a Semiconductor Wafer Polished by a Chemical Mechanical Polishing
Application: 09/770,501 →
Voltage-dropping power unit for semiconductor memory device
Application: 09/754,265 →
Semiconductor device
Application: 09/754,262 →