Patent Application
Utility
App. No. 09/910,953
· Confirmation No. 3636
BONDING PAD, SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
Inventor:
Shigenari Aoki
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-07-24 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-07-24 | SPEC |
Specification | 13 | View | |
| 2001-07-24 | CLM |
Claims | 2 | View | |
| 2001-07-24 | ABST |
Abstract | 1 | View | |
| 2001-07-24 | DRW |
Drawings-only black and white line drawings | 6 | View | |
| 2001-07-24 | OATH |
Oath or Declaration filed | 3 | View |
Inventors
Shigenari Aoki
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
438/15
H10P74/23
H10W72/012
H10W72/983
H10W72/536
H10W72/923
H10W72/931
H10W72/952
H10W72/531
H10W72/29
H10W72/5522
H10W72/07553
H10W72/59
H10W72/019
H10W72/934
H10W72/251
Prosecution
- Examiner
- PHAM, LONG
- Art Unit
- 2897
- Customer No.
- 23995
- Docket No.
- OHG 124
- Confirmation No.
- 3636
Foreign Priority
109936/2001
·
2001-04-09
·
JAPAN
Publication
- Pub. No.
- US20020146898A1
- Pub. Date
- 2002-10-10
Patent Term Adjustment
0days
No related applications found.
from
AOKI, SHIGENARI
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-07-24
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Quick Facts
- App. No.
- 09/910,953
- Filed
- 2001-07-24
- Granted
- 2003-06-17
- Pub. No.
- US20020146898A1
- Examiner
- PHAM, LONG
- Art Unit
- 2897
- PTA
- 0 days
External Links