Patent Assignment
Reel/Frame 012020/0542
Assignment of Assignor's Interest
Recorded: 2001-07-24
Pages: 3
Assignor
AOKI, SHIGENARI
Executed: 2001-07-16
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
MINATO-KU, 7-12 TORANOMON 1-CHOME, TOKYO, JAPAN
Covered Property
(1)
Bonding Pad, Semiconductor Device and Wire Bonding Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.