IP Library › Granted Patent US 6,482,732
Granted Patent Utility
US 6,482,732 · Confirmation No. 3455

METHOD AND APPARATUS FOR POLISHING SEMICONDUCTOR WAFER

Inventor: Shunichi Tokitoh
Patented Case View Patent ↗
⬇ PDF
 Code Description Pages PDF
2001-06-29 TRNA Transmittal of New Application 2 View
2001-06-29 SPEC Specification 12 View
2001-06-29 CLM Claims 7 View
2001-06-29 ABST Abstract 1 View
2001-06-29 DRW Drawings-only black and white line drawings 8 View
2001-06-29 OATH Oath or Declaration filed 3 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,482,732
App. No.
09/894,886
Filed
2001-06-29
Granted
2002-11-19
Art Unit
2813
PTA
-103 days