IP Library › Granted Patent US 6,480,017
Granted Patent Utility
US 6,480,017 · Confirmation No. 7379

EVALUATING PATTERN FOR MEASURING AN EROSION OF A SEMICONDUCTOR WAFER POLISHED BY A CHEMICAL MECHANICAL POLISHING

Inventor: Tadashi Narita
Patented Case View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-01-29 TRNA Transmittal of New Application 4 View
2001-01-29 SPEC Specification 13 View
2001-01-29 CLM Claims 2 View
2001-01-29 ABST Abstract 1 View
2001-01-29 DRW Drawings-only black and white line drawings 4 View
2001-01-29 OATH Oath or Declaration filed 3 View
2001-01-29 TRNA Transmittal of New Application 4 View
2001-01-29 SPEC Specification 13 View
2001-01-29 CLM Claims 2 View
2001-01-29 ABST Abstract 1 View
2001-01-29 DRW Drawings-only black and white line drawings 4 View
2001-01-29 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,480,017
App. No.
09/770,501
Filed
2001-01-29
Granted
2002-11-12
Pub. No.
US20020036505A1
Art Unit
2858
PTA
0 days