IP Library Granted Patent US 6,960,966
Granted Patent B2
US 6,960,966 · App. 10/668,379 · Granted Nov 1, 2005

Surface acoustic wave filter with attenuation poles

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Quick Facts
Patent No.
US 6,960,966
App. No.
10/668,379
Granted
Nov 1, 2005
Kind
B2
Abstract

A high-performance SAW filter is to be provided which has lower insertion loss in a pass band and high attenuation in an attenuation band on the low frequency side of the pass band. In a SAW filter with attenuation poles configured of a two-port circuit for filtering for forming a ladder type SAW filter using a SAW resonator and a two-port circuit for impedance formed of an impedance serially connected, the impedance of the two-port circuit for impedance is configured so as to form an attenuation band of a predetermined width having a sufficient attenuation characteristic on the low frequency side of a pass band.

Claims (22)

1. A surface acoustic wave filter with attenuation poles comprising:

a two-port circuit for filtering, comprising a ladder type surface acoustic wave filter with a surface acoustic wave resonator; and

a two-port circuit for impedance connected to the two-port circuit for filtering,

wherein the impedance of the two-port circuit for impedance is configured so as to form an attenuation band of a predetermined width having a substantial attenuation characteristic on a low frequency side of a pass band, and

wherein the two-port circuit for impedance comprises a bonding wire having a ratio of resistance to inductance of about 0.4 ohms per nH or less.

2. A surface acoustic wave filter with attenuation poles according to claim 1 , wherein the two-port circuit for impedance further comprises an additional bonding wire.

3. A surface acoustic wave filter with attenuation poles according to claim 1 , wherein two-port circuit for impedance further comprises a capacitance connected in parallel to one of the bonding wires.

4. A surface acoustic wave filter with attenuation poles comprising:

a two-port circuit for filtering, comprising a ladder type surface acoustic wave filter with a surface acoustic wave resonator; and

a two-port circuit for impedance connected to the two-port circuit for filtering,

wherein the two-port circuit for impedance is configured as a π type circuit having three impedances so as to form an attenuation band of a predetermined width having a substantial attenuation characteristic on a low frequency side of a pass band, and

wherein the π type circuit comprises a plurality of bonding wires, each of the bonding wires having an inductance of about 0.5 nH and a resistance of about 0.2 ohms or less.

5. A surface acoustic wave filter with attenuation poles comprising:

a two-port circuit for filtering, comprising a ladder type surface acoustic wave filter with a surface acoustic wave resonator; and

a two-port circuit for impedance connected to the two-port circuit for filtering,

wherein the two-port circuit for impedance is configured as a π type circuit having three impedances so as to form an attenuation band of a predetermined width having a substantial attenuation characteristic on a low frequency side of a pass band, and

wherein the π type circuit comprises a plurality of bonding wires, each of the bonding wires having an inductance of about one nH and a resistance of about 0.4 ohms or less.

6. A surface acoustic wave filter with attenuation poles comprising:

a two-port circuit for filtering, comprising a ladder type surface acoustic wave filter with a surface acoustic wave resonator; and

a two-port circuit for impedance connected to the two-port circuit for filtering,

wherein the two-port circuit for impedance is configured as a π type circuit having three impedances so as to form an attenuation band of a predetermined width having a substantial attenuation characteristic on a low frequency side of a pass band, and

wherein the π type circuit comprises a plurality of bonding wires, each of the bonding wires having about the same impedance and a ratio of resistance to inductance of about 0.4 ohms per nH or less.

Assignments (3)
CHANGE OF NAME Recorded Jan 31, 2012
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 027622/0360 →
CHANGE OF NAME Recorded Dec 4, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022043/0739 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2004
From: NOGUCHI, KAZUSHIGE; OHASHI, WATARU; KOMAZAKI, TOMOKAZU
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 014846/0648 →