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App. No. 09/866,815 · Confirmation No. 5101

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE THAT PROTECT INTERCONNECT WIRINGS DURING PROCESSING OF BACK SUBSTRATE SURFACE

Inventor: Tadashi Igarashi
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-05-30 TRNA Transmittal of New Application 4 View
2001-05-30 SPEC Specification 25 View
2001-05-30 CLM Claims 4 View
2001-05-30 ABST Abstract 1 View
2001-05-30 DRW Drawings-only black and white line drawings 10 View
2001-05-30 OATH Oath or Declaration filed 3 View
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Quick Facts
App. No.
09/866,815
Filed
2001-05-30
Granted
2003-02-25
Pub. No.
US20020081831A1
Art Unit
2813
PTA
0 days