Patent Assignment
Reel/Frame 012022/0372
Assignment of Assignor's Interest
Recorded: 2001-07-20
Received: 2001-08-02
Pages: 5
Assignors
CONTI, RICHARD A.
Executed: 2001-07-09
EDELSTEIN, DANIEL C.
Executed: 2001-07-09
SHAFER, PADRAIC C.
Executed: 2001-07-13
DOBUZINSKY, DAVID M.
Executed: 2001-07-16
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NY, 10504, UNITED STATES
Covered Property
(1)
Carbon-Graded Layer for Improved Adhesion of Low-K Dielectrics to Silicon Substrates
Application:
09/910,380 →