IP Library › Granted Patent US 6,570,256
Granted Patent Utility
US 6,570,256 · Confirmation No. 2319

CARBON-GRADED LAYER FOR IMPROVED ADHESION OF LOW-K DIELECTRICS TO SILICON SUBSTRATES

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 Code Description Pages PDF
2010-03-18 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2001-07-20 TRNA Transmittal of New Application 4 View
2001-07-20 SPEC Specification 9 View
2001-07-20 CLM Claims 6 View
2001-07-20 ABST Abstract 1 View
2001-07-20 DRW Drawings-only black and white line drawings 3 View
2001-07-20 OATH Oath or Declaration filed 12 View
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Quick Facts
Patent No.
US 6,570,256
App. No.
09/910,380
Filed
2001-07-20
Granted
2003-05-27
Pub. No.
US20030017642A1
Art Unit
2825
PTA
0 days