IP Library › Granted Patent US 6,740,539
Granted Patent Utility
US 6,740,539 · Confirmation No. 9957

CARBON-GRADED LAYER FOR IMPROVED ADHESION OF LOW-K DIELECTRICS TO SILICON SUBSTRATES

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2004-04-20 IFEE Issue Fee Payment (PTO-85B) 1 View
2004-01-27 NOA Notice of Allowance and Fees Due (PTOL-85) 3 View
2004-01-27 NOA Notice of Allowance and Fees Due (PTOL-85) 3 View
2004-01-27 892 List of references cited by examiner 1 View
2004-01-27 1449 List of References cited by applicant and considered by examiner 3 View
2004-01-27 IIFW Issue Information including classification, examiner, name, claim, renumbering, etc. 1 View
2004-01-27 FWCLM Index of Claims 1 View
2004-01-27 SRFW Search information including classification, databases and other search related notes 1 View
2004-01-15 SRNT Examiner's search strategy and results 2 View
2003-12-03 SRNT Examiner's search strategy and results 7 View
2003-06-02 IDS Information Disclosure Statement (IDS) Form (SB08) 5 View
2003-02-13 TRNA Transmittal of New Application 5 View
2003-02-13 A.PE Preliminary Amendment 4 View
2003-02-13 SPEC Specification 8 View
2003-02-13 CLM Claims 6 View
2003-02-13 ABST Abstract 1 View
2003-02-13 DRW Drawings-only black and white line drawings 3 View
2003-02-13 OATH Oath or Declaration filed 6 View
2003-02-13 WFEE Fee Worksheet (SB06) 1 View
2003-02-13 WFEE Fee Worksheet (SB06) 1 View
2003-02-13 WCLM Claims Worksheet (PTO-2022) 1 View
2003-02-13 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
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Quick Facts
Patent No.
US 6,740,539
App. No.
10/366,149
Filed
2003-02-13
Granted
2004-05-25
Pub. No.
US20030153198A1
Art Unit
2814
PTA
0 days