Patent Assignment
Reel/Frame 012028/0199
Assignment of Assignor's Interest
Recorded: 2001-07-25
Pages: 2
Assignor
ICHINOSE, MICHIHIKO
Executed: 2001-07-19
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Bga Type Semiconductor Device Having a Solder-Flow Damping/Stopping Pattern
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.