Patent Assignment
Reel/Frame 013784/0714
Assignment of Assignor's Interest
Recorded: 2003-03-03
Received: 2003-03-05
Pages: 6
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, JPX, 211-8668, JAPAN
Covered Properties
(57)
Capacitor Element Having a Contact Hole Structure in an Electrode Structure
Application:
10/254,399 →
Liquid-Crystal Display Device and Method of Signal Transmission Thereof
Application:
10/236,280 →
Semiconductor Device
Application:
10/210,157 →
Semiconductor device having an external electrode
Application:
10/197,149 →
Semiconductor Device
Application:
10/170,842 →
Non-Volatile Semiconductor Memory Device and Manufacturing Method Thereof
Application:
10/157,072 →
Semiconductor Storage and Method for Testing the Same
Application:
10/148,430 →
Semiconductor device having a support structure
Application:
10/136,155 →
Lead frame having semiconductor device mounted thereon and including engageable protectective protrusions and method for fabricating the same
Application:
10/128,204 →
Integrated Circuit Device with Mim Capacitance Circuit and Method of Manufacturing the Same
Application:
10/119,185 →
Semiconductor Device and Process for Fabricating the Same
Application:
10/113,509 →
Method and System for Insertion and Extraction of Overhead in Sonet/Sdh
Application:
10/107,765 →
Method of forming capacitor element
Application:
10/098,302 →
Semiconductor Integrated Circuit Device
Application:
10/092,169 →
Signal-Adjusted Lcd Control Unit
Application:
10/090,954 →
Method of forming an opening by etching an organic layer in multiple etching steps at reduced pressures
Application:
10/087,498 →
Method of fabricating semiconductor device
Application:
10/080,055 →
Integrated circuit with bipolar transistors having different emitter base junction widths
Application:
10/061,118 →
Brushless Motor Driving Device
Application:
10/057,158 →
Semiconductor Apparatus and a Semiconductor Device Mounting Method
Application:
10/057,572 →
Cleaner for cleaning a capillary tube for use in a wire bonding tool
Application:
10/054,559 →
Semiconductor Device with Reduced Leakage of Current
Application:
10/033,628 →
Semiconductor Apparatus Including Cmos Circuits and Method for Fabricating the Same
Application:
09/995,513 →
Semiconductor device with heavily doped shallow region and process for fabricating the same
Application:
10/012,632 →
Mask for Beam Exposure Having Membrane Structure and Stencil Structure and Method for Manufacturing the Same
Application:
09/982,051 →
A Particle-Removing Method for a Semiconductor Device Manufacturing Apparatus
Application:
09/971,463 →
Mounting pin and mounting device
Application:
09/949,046 →
Method of starting brushless DC motor on the basis of induced voltage in armature coil for detection of position of rotor
Application:
09/940,731 →
Semiconductor Device and Manufacturing Method Thereof
Application:
09/939,396 →
Delay Circuit and Method
Application:
09/923,997 →
Semiconductor Wafer, Semiconductor Device and Manufacturing Method Therefor
Application:
09/916,837 →
Bga Type Semiconductor Device Having a Solder-Flow Damping/Stopping Pattern
Application:
09/912,887 →
Low Power Consuming Circuit
Application:
09/898,979 →
Liquid Crystal Display Module Capable of Avoiding Generation of Rib-Like Patterns
Application:
09/894,361 →
Method of Designing Semiconductor Device and Method of Manufacturing Semiconductor Device
Application:
09/894,405 →
Fabrication Process for a Semiconductor Device with Damascene Interconnect Lines of the Same Level Separated by Insulators with Different Dielectric Constants
Application:
09/893,926 →
Semiconductor Integrated Circuit and Semiconductor Integrated Circuit Wiring Layout Method
Application:
09/888,992 →
Semiconductor Memory Device Improving Data Read-Out Access
Application:
09/880,469 →
Wiring Failure Analysis Method Using Simulation of Electromigration
Application:
09/872,533 →
Buffer Circuit Block and Design Method of Semiconductor Integrated Circuit by Using the Same
Application:
09/864,025 →
Nonvolatile Semiconductor Memory Device Including a Boundary Region
Application:
09/860,345 →
Apparatus for Spin-Coating Semiconductor Substrate and Method of Doing the Same
Application:
09/854,614 →
Semiconductor device and method of fabricating the same
Application:
09/848,157 →
Semiconductor Memory
Application:
09/847,260 →
Design System for Flip Chip Semiconductor Device
Application:
09/844,351 →
Semiconductor device having a test pattern same as conductive pattern to be tested for short-circuit
Application:
09/843,090 →
Semiconductor Device Having a Protective Circuit
Application:
09/837,823 →
A Dual Damascene Structure with Carbon Containing SIO2 Dielectric Layers
Application:
09/837,683 →
Method for Manufacturing Semiconductor Devices
Application:
09/837,736 →
Semiconductor Device and Method of Its Fabrication
Application:
09/829,877 →
Semiconductor device having a fuse
Application:
09/822,791 →
Manufacture of a Semiconductor Device
Application:
09/804,788 →
Semiconductor Manufacturing Apparatus with an Improved Wafer Cassette
Application:
09/785,848 →
Method of and Apparatus for Developing Exposed Photoresist to Prevent Impurity from Being Attached to Wafer Surface
Application:
09/772,291 →
Stripper composition and stripping method
Application:
09/766,896 →
Method of Designating Output "Don't Care" and Processor of Processing Logic Circuit Data
Application:
09/760,624 →
Embedded Lsi Having a Feram Section and a Logic Circuit Section
Application:
09/752,950 →