IP Library › Assignment 012113/0623
Patent Assignment
Reel/Frame 012113/0623

Assignment of Assignor's Interest

Recorded: 2001-08-23 Pages: 2
Assignor
ARAKAWA, HIDEYUKI
Executed: 2001-08-06
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8, JAPAN
Covered Property (1)
Semiconductor Device and Manufacturing Method Thereof.
Patent: 6,774,494 →
Application: 09/934,643 →
Publication: US 2002/0137327
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Change of Name Sep 8, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024953/0237 →