Patent Assignment
Reel/Frame 012120/0366
Assignment of Assignor's Interest
Recorded: 2001-08-22
Pages: 4
Assignors
SCHAFFER, CHRISTOPHER
Executed: 2001-06-28
BURKHART, STEVEN R.
Executed: 2001-06-28
PRICE, BARTLEY J.
Executed: 2001-06-28
Assignee
BOEING COMPANY, INC. THE
SEATTLE, WASHINGTON
Covered Property
(1)
Microelectronic Device Structure Utilizing a Diamond Inlay in a Package Flange
Patent:
6,489,634 →
Application:
09/938,073 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Confirmatory License
Feb 3, 2003
From: BOEING
To: DARPA
Reel/Frame 013711/0582 →
Correct Name of Receiving Party Reel 012120 Frame 0366.
Apr 8, 2011
From: SCHAFFER, CHRISTOPHER; BURKHART, STEVEN R.; PRICE, BARTLEY J.
To: BOEING COMPANY, THE
Reel/Frame 026104/0093 →
Assignment of Assignor's Interest
Aug 1, 2011
From: THE BOEING COMPANY
To: EPHALION FUND LIMITED LIABILITY COMPANY
Reel/Frame 026680/0262 →
Merger
Jan 19, 2016
From: EPHALION FUND LIMITED LIABILITY COMPANY
To: GULA CONSULTING LIMITED LIABILITY COMPANY
Reel/Frame 037526/0293 →