Patent Assignment
Reel/Frame 012150/0277
Assignment of Assignor's Interest
Recorded: 2001-08-23
Pages: 4
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, P.O. BOX 6/83707-0006, BOISE, IDAHO, 83716
Covered Property
(1)
Methods for Making Semiconductor Structures Having High-Speed Areas and High-Density Areas
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Invalid Assignment. See Recording on Reel 012482 Frame 0128. (Re-Record to Correct Recordation Date from 8-23-01 to 08-30-01.
Aug 30, 2001
From: CHO, CHIH-CHEN; WANG, ZHONGZE
To: MICRON TECHNOLOGY, INC.
Reel/Frame 012482/0128 →
Security Interest
May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Patent Security Agreement
Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
Corrective Assignment to Correct the Replace Erroneously Filed Patent #7358718 with the Correct Patent #7358178 Previously Recorded on Reel 038669 Frame 0001. Assignor(S) Hereby Confirms the Security Interest.
Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →