Patent Assignment
Reel/Frame 012180/0272
Assignment of Assignor's Interest
Recorded: 2001-09-17
Received: 2001-09-25
Pages: 3
Assignor
LEE, JIN YUAN
Executed: 2001-08-02
Assignee
MEGIC CORP.
SCIENCE-BASED INDUSTRIAL PARK, 21, R&D FIRST ROAD, HSIN-CHU, TWX, R.O.C, TAIWAN
Covered Property
(1)
Structure of High Performance Combo Chip and Processing Method
Application:
09/953,544 →