IP Library › Granted Patent US 6,613,606
Granted Patent Utility
US 6,613,606 · Confirmation No. 6134

STRUCTURE OF HIGH PERFORMANCE COMBO CHIP AND PROCESSING METHOD

Inventor: Jin-Yuan Lee
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2014-05-08 IFEE Issue Fee Payment (PTO-85B) 1 View
2014-05-08 WFEE Fee Worksheet (SB06) 2 View
2014-05-08 N417 Electronic Filing System Acknowledgment Receipt 2 View
2013-07-12 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2013-07-12 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2013-05-31 PA.. Power of Attorney 1 View
2013-05-31 N417 Electronic Filing System Acknowledgment Receipt 2 View
2013-05-31 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2011-04-04 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2011-04-04 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2011-03-23 PA.. Power of Attorney 1 View
2011-03-23 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2011-03-23 N417 Electronic Filing System Acknowledgment Receipt 2 View
2011-03-23 TRAN.LET Transmittal Letter 1 View
2011-03-23 LET. Miscellaneous Incoming Letter 1 View
2003-06-27 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-06-27 DRW Drawings-only black and white line drawings 2 View
2003-06-27 LET. Miscellaneous Incoming Letter 3 View
2001-09-17 TRNA Transmittal of New Application 2 View
2001-09-17 SPEC Specification 31 View
2001-09-17 CLM Claims 21 View
2001-09-17 ABST Abstract 1 View
2001-09-17 DRW Drawings-only black and white line drawings 12 View
2001-09-17 OATH Oath or Declaration filed 1 View
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Quick Facts
Patent No.
US 6,613,606
App. No.
09/953,544
Filed
2001-09-17
Granted
2003-09-02
Art Unit
2823
PTA
-6 days