Patent Assignment
Reel/Frame 012194/0617
Assignment of Assignor's Interest
Recorded: 2001-09-13
Pages: 3
Assignors
CHO, KANG-SIK
Executed: 2001-08-09
PARK, CHUL-SUNG
Executed: 2001-08-10
KIM, GYU-CHUL
Executed: 2001-08-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, PALDAL-KU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having a Fuse Connected to a Pad and Fabrication Method Thereof