IP Library › Assignment 012196/0277
Patent Assignment
Reel/Frame 012196/0277

Assignment of Assignor's Interest

Recorded: 2001-09-20 Pages: 3
Assignors
ROETERS, GLEN E.
Executed: 2001-09-13
MANTZ, FRANK E.
Executed: 2001-09-18
Assignee
DENSE-PAC MICROSYSTEMS, INC.
7321 LINCOLN WAY, GARDEN GROVE, CALIFORNIA, 92841
Covered Property (1)
Retaining Ring Interconnect Used for 3-D Stacking
Patent: 6,573,461 →
Application: 09/957,373 →
Publication: US 2003/0051907
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 25, 2004
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.)
To: STAKTEK GROUP L.P.
Reel/Frame 015521/0622 →
Change of Name Jan 26, 2010
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 023848/0062 →