Patent Assignment
Reel/Frame 023848/0062
Change of Name
Recorded: 2010-01-26
Pages: 8
Assignor
STAKTEK GROUP, L.P.
Executed: 2008-02-29
Assignee
ENTORIAN TECHNOLOGIES L.P.
4030 WEST BRAKER LANE, BUILDING 2-100, AUSTIN, TEXAS, 78759
Covered Properties
(135)
Lead-On-Chip Integrated Circuit Apparatus
Patent:
5,448,450 →
Application:
07/783,737 →
High Density Lead-on-Package Fabrication Method and Apparatus
Patent:
5,484,959 →
Application:
07/990,334 →
Warp-Resistent Ultra-Thin Integrated Circuit Package Fabrication Method
Patent:
5,369,056 →
Application:
08/037,830 →
Ultra High Density Integrated Circuit Packages Method
Patent:
5,367,766 →
Application:
08/043,196 →
Ultra High Density Integrated Circuit Packages Method and Apparatus
Patent:
5,446,620 →
Application:
08/133,395 →
Ultra High Density Modular Integrated Circuit Package
Patent:
5,420,751 →
Application:
08/133,397 →
Ultra High Density Integrated Circuit Packages Method and Apparatus
Patent:
5,377,077 →
Application:
08/168,354 →
Warp-Resistent Ultra-Thin Integrated Circuit Package Fabrication Method
Patent:
5,369,058 →
Application:
08/206,301 →
Bus Communication System for Stacked High Density Integrated Circuit Packages
Patent:
5,455,740 →
Application:
08/206,829 →
Warp-Resistant Ultra-Thin Integrated Circuit Package
Patent:
5,581,121 →
Application:
08/280,968 →
Multi-Signal Rail Assembly with Impedance Control for a Three-Dimensional High Density Integrated Circuit Package
Patent:
5,561,591 →
Application:
08/289,468 →
Ultra High Density Integrated Circuit Packages Method and Apparatus
Patent:
5,566,051 →
Application:
08/298,544 →
Hermetically Sealed Ceramic Integrated Circuit Heat Dissipating Package Fabrication Method
Patent:
5,702,985 →
Application:
08/325,719 →
Hermetically Sealed Ceramic Integrated Circuit Heat Dissipating Package
Patent:
5,572,065 →
Application:
08/328,338 →
Lead-On-Chip Integrated Circuit Apparatus
Patent:
5,528,075 →
Application:
08/375,874 →
High Density Integrated Circuit Module with Complex Electrical Interconnect Rails
Patent:
5,592,364 →
Application:
08/377,578 →
Hermetically Sealed Integrated Circuit Lead-on Package Configuration
Patent:
5,804,870 →
Application:
08/380,541 →
Chip Stack and Method of Making Same
Patent:
5,612,570 →
Application:
08/421,801 →
Ultra High Density Integrated Circuit Packages
Patent:
5,550,711 →
Application:
08/436,902 →
Bus Communication System for Stacked High Density Integrated Circuit Packages with Trifurcated Distal Lead Ends
Patent:
5,479,318 →
Application:
08/440,500 →
Bus Communication System for Stacked High Density Integrated Circuit Packages with Bifurcated Distal Lead Ends
Patent:
5,493,476 →
Application:
08/445,848 →
Simulcast Standard Multichip Memory Addressing System
Patent:
36,229 →
Application:
08/510,729 →
Three-Dimensional Warp-Resistant Integrated Circuit Module Method and Apparatus
Patent:
5,801,437 →
Application:
08/514,294 →
Lead-On-Chip Integrated Circuit Apparatus
Patent:
5,654,877 →
Application:
08/516,848 →
Method of Manufacturing an Integrated Package Having a Pair of Die on a Common Lead Frame
Patent:
5,615,475 →
Application:
08/517,485 →
Bus Communication System for Stacked High Density Integrated Circuit Packages Having an Intermediate Lead Frame
Patent:
5,541,812 →
Application:
08/526,470 →
Integrated Circuit Package with Overlapped Die on a Common Lead Frame
Patent:
5,585,668 →
Application:
08/601,880 →
Warp-Resistent Ultra-Thin Integrated Circuit Package Fabrication Method
Patent:
5,864,175 →
Application:
08/644,491 →
Integrated Circuit Packages Having an Externally Mounted Lead Frame Having Bifurcated Distal Lead Ends
Patent:
5,978,227 →
Application:
08/645,319 →
Method of Manufacturing a High Density Integrated Circuit Module with Complex Electrical Interconnect Rails Having Electrical Interconnect Strain Relief
Patent:
5,778,522 →
Application:
08/650,721 →
Method of Manufacturing an Uktra-High Density Warp-Resistant Memory Module
Patent:
5,843,807 →
Application:
08/686,985 →
Ultra-High Density Warp-Resistant Memory Module
Patent:
5,828,125 →
Application:
08/758,839 →
Method of Forming a Hermetically Sealed Circuit Lead-on Package
Patent:
5,783,464 →
Application:
08/798,556 →
Apparatus and Method of Manufacturing a Warp Resistant Thermally Conductive Integrated Circuit Package
Patent:
5,945,732 →
Application:
08/815,537 →
Three-Dimensional Warp-Resistant Integrated Circuit Module Method and Apparatus
Patent:
5,895,232 →
Application:
08/888,850 →
Ultra High Density Integrated Circuit Packages
Patent:
6,049,123 →
Application:
08/935,380 →
Ultra High Density Integrated Circuit Packages
Patent:
6,025,642 →
Application:
08/937,200 →
Modular Panel Stacking Process
Patent:
5,869,353 →
Application:
08/971,499 →
Method of Making High Density Circuit Module
Patent:
5,960,539 →
Application:
09/021,744 →
Chip Stack and Method of Making Same
Patent:
6,180,881 →
Application:
09/073,254 →
Method of Manufacturing a Warp Resistant Thermally Conductive Circuit Package
Patent:
6,190,939 →
Application:
09/115,293 →
Clock Driver with Instantaneously Selectable Phase and Method for Use in Data Communication System
Patent:
6,282,210 →
Application:
09/133,297 →
Warp-Resistent Ultra-Thin Integrated Circuit Package Fabrication Method
Patent:
6,194,247 →
Application:
09/159,120 →
Stacked Micro Ball Grid Array Packages
Patent:
6,310,392 →
Application:
09/221,350 →
Method of Manufacturing a Surface Mount Package
Patent:
6,205,654 →
Application:
09/222,263 →
Universal Package and Method of Forming the Same
Patent:
6,222,737 →
Application:
09/298,664 →
Stackable Flex Circuit Ic Package and Method of Making Same
Patent:
6,323,060 →
Application:
09/305,584 →
High Density Integrated Circuit Module with Complex Electrical Interconnect Rails Having Electrical Interconnect Strain Relief
Patent:
6,288,907 →
Application:
09/343,432 →
Ultra High Density Integrated Circuit Packages
Patent:
6,168,970 →
Application:
09/434,534 →
Stackable Chip Package with Flex Carrier
Patent:
6,262,895 →
Application:
09/482,294 →
Csp Stacking Technology Using Rigid/Flex Construction
Patent:
6,437,433 →
Application:
09/535,641 →
Stackable flex circuit chip package and method of making same
Patent:
6,351,029 →
Application:
09/574,321 →
Chip stack with active cooling system
Patent:
6,236,565 →
Application:
09/594,363 →
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Patent:
6,404,043 →
Application:
09/598,343 →
Rambus Stakpak
Patent:
6,404,662 →
Application:
09/646,724 →
Stacking System and Method
Patent:
6,608,763 →
Application:
09/663,753 →
method of forming universal package
Patent:
6,360,433 →
Application:
09/664,938 →
Stackable Flex Circuit Ic Package and Method of Making Same
Patent:
6,426,549 →
Application:
09/706,015 →
High Density Integrated Circuit Module
Contact Member Stacking System and Method
Three-Dimensional Memory Stacking Using Anisotropic Epoxy Interconnections
Stackable Chip Package with Flex Carrier
Stackable Flex Circuit Chip Package and Method of Making Same
Stackable Flex Circuit Ic Package and Method of Making Same
Chip Stack with Differing Chip Package Types
Wide Data Path Stacking System and Method
Patent:
6,618,257 →
Application:
09/916,625 →
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Post in Ring Interconnect Using for 3-D Stacking
Retaining Ring Interconnect Used for 3-D Stacking
Chip Scale Stacking System and Method
Patent:
6,576,992 →
Application:
10/005,581 →
Csp Chip Stack with Flex Circuit
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Contact Member Stacking System and Method
Flexible Circuit Connector for Stacked Chip Module
Integrated Circuit Stacking System and Method
Method of Assembling a Stackable Integrated Circuit Chip
Chip Stack with Differing Chip Package Types
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Modularized Die Stacking System and Method
Flexible Circuit Connector for Stacked Chip Module
Memory Expansion and Chip Scale Stacking System and Method
Thin Scale Outline Package
Low Profile Chip Scale Stacking System and Method
Memory Expansion and Chip Scale Stacking System and Method
Reflection-Control System and Method
Memory Expansion and Integrated Circuit Stacking System and Method
Contact Member Stacking System and Method
Integrated Circuit Stacking System and Method
Stacked Module Systems and Methods
Low Profile Chip Scale Stacking System and Method
Stackable Flex Circuit Ic Package and Method of Making Same
Patent:
39,628 →
Application:
10/900,073 →
Pitch Change and Chip Scale Stacking System
Integrated Circuit Stacking System
Integrated Circuit Stacking System and Method
Memory Expansion and Chip Scale Stacking System and Method
Thin Module System and Method
Buffered Thin Module System and Method
Low Profile Stacking System and Method
Inverted Csp Stacking System and Method
Thin Module System and Method
High Capacity Thin Module System and Method
Pitch Change and Chip Scale Stacking System and Method
Memory Module System and Method
Module Thermal Management System and Method
Stacked Module Systems and Method
Patent:
7,033,861 →
Application:
11/131,812 →
Die Module System
Compact Module System and Method
Stacking System and Method
High Capacity Thin Module System
Leaded Package Integrated Circuit Stacking
Optimized Mounting Area Circuit Module System and Method
Stacked Module Systems and Methods
Flex Circuit Apparatus and Method for Adding Capacitance While Conserving Circuit Board Surface Area
Circuit Module with Thermal Casing Systems
Stacked Integrated Circuit Module
Flex Circuit Constructions for High Capacity Circuit Module Systems and Methods
Circuit Module Turbulence Enhacement Systems and Methods
Composite Core Circuit Module System and Method
Active Cooling Methods and Apparatus for Modules
Stacked Module Systems and Method
Memory Card and Method for Devising
Managed Memory Component
Managed Memory Component
Carrier Structure Stacking System and Method
Interposer Stacking System and Method
Stacking System and Method
Contrast Interposer Stacking System and Method
Circuit Module Having Force Resistant Construction
Stackable Micropackages and Stacked Modules
Buffered Memory Device
Split Core Circuit Module
Stacked Module Systems and Methods
High Capacity Thin Module System and Method
High Capacity Thin Module System and Method
High Capacity Thin Module System
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger
Sep 28, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029048/0636 →
Merger
Sep 28, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029048/0376 →
Merger
Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →
Merger
Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
Change of Name
Dec 2, 2012
From: DENSE-PAC MICROSYSTEMS, INC.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 029395/0945 →
Assignment of Assignor's Interest
Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Corrective Assignment to Correct the State of Incorporation Within the Assignment Document Previously Recorded on Reel 011177, Frame 0921.Assignors Hereby Confirms the State of Incorporation Is Texas.
Jun 27, 2013
From: STAKTEK CORPORATION
To: STAKTEK GROUP L.P.
Reel/Frame 030962/0142 →
Merger
Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →
Assignment of Assignor's Interest
Nov 10, 2023
From: KOLSTER, PETER RUDOLF; EVELEENS, CORNELIS PIETER
To: KOLSTER HOLDING BV; HORTEVE BREEDING BV
Reel/Frame 065521/0164 →