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App. No. 10/202,185 · Confirmation No. 9052

METHOD OF ASSEMBLING A STACKABLE INTEGRATED CIRCUIT CHIP

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2007-04-12 PA.. Power of Attorney 10 View
2007-04-12 N417 Electronic Filing System Acknowledgment Receipt 2 View
2003-10-09 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-07-24 TRNA Transmittal of New Application 4 View
2002-07-24 A.PE Preliminary Amendment 1 View
2002-07-24 SPEC Specification 18 View
2002-07-24 CLM Claims 7 View
2002-07-24 ABST Abstract 1 View
2002-07-24 DRW Drawings-only black and white line drawings 3 View
2002-07-24 OATH Oath or Declaration filed 5 View
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Quick Facts
App. No.
10/202,185
Filed
2002-07-24
Granted
2003-12-09
Pub. No.
US20020185724A1
Art Unit
2814
PTA
-3 days