Patent Assignment
Reel/Frame 013151/0809
Assignment of Assignor's Interest
Recorded: 2002-07-24
Received: 2002-08-08
Pages: 4
Assignee
DENSE-PAC MICROSYSTEMS, INC.
7321 LINCOLN WAY, GARDEN GROVE, CA, 92841, UNITED STATES
Covered Property
(1)
Method of Assembling a Stackable Integrated Circuit Chip
Application:
10/202,185 →