IP Library › Assignment 015503/0813
Patent Assignment
Reel/Frame 015503/0813

Assignment of Assignor's Interest

Recorded: 2004-06-25 Pages: 22
Assignor
DPAC TECHNOLOGIES CORP
Executed: 2004-06-09
Assignee
STAKTEK GROUP, L.P.
8900 SHOAL GREEK BLVD., SUITE 125, AUSTIN, TEXAS, 78757
Covered Property (1)
Method of Assembling a Stackable Integrated Circuit Chip
Patent: 6,660,561 →
Application: 10/202,185 →
Publication: US 2002/0185724
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 26, 2010
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 023848/0062 →
Assignment of Assignor's Interest Jan 29, 2010
From: DPAC TECHNOLOGIES CORP.
To: STAKTEK GROUP L.P.
Reel/Frame 023870/0245 →
Assignment of Assignor's Interest Jan 29, 2010
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.); DENSE-PAC MICROSYSTEMS, INC. (NOW KNOWN AS DPAC TECHNOLOGIES CORP.)
To: STAKTEK GROUP L.P.
Reel/Frame 023870/0297 →