IP Library › Assignment 023870/0297
Patent Assignment
Reel/Frame 023870/0297

Assignment of Assignor's Interest

Recorded: 2010-01-29 Pages: 12
Assignors
Assignee
STAKTEK GROUP L.P.
8900 SHOAL CREEK BLVD., SUITE 125, AUSTIN, TEXAS, 78757
Covered Properties (8)
Universal Package and Method of Forming the Same
Patent: 6,222,737 →
Application: 09/298,664 →
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Patent: 6,404,043 →
Application: 09/598,343 →
Stackable Flex Circuit Ic Package and Method of Making Same
Patent: 6,426,549 →
Application: 09/706,015 →
Stackable Chip Package with Flex Carrier
Patent: 6,473,308 →
Application: 09/838,773 →
Publication: US 2001/0015487
Chip Stack with Differing Chip Package Types
Patent: 6,627,984 →
Application: 09/912,010 →
Publication: US 2003/0020153
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Patent: 6,544,815 →
Application: 09/922,977 →
Publication: US 2001/0054770
Method of Assembling a Stackable Integrated Circuit Chip
Patent: 6,660,561 →
Application: 10/202,185 →
Publication: US 2002/0185724
Stackable Flex Circuit Ic Package and Method of Making Same
Patent: 39,628 →
Application: 10/900,073 →
Related Assignments (16)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Jan 26, 2010
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 023848/0062 →
Assignment of Assignor's Interest Jan 29, 2010
From: ISAAK, HARLAN R.
To: DENSE-PAC MICROSYSTEMS, INC.
Reel/Frame 023870/0421 →
Assignment of Assignor's Interest Jan 29, 2010
From: FORTHUN, JOHN A.
To: DENSE-PAC MICROSYSTEMS, INC.
Reel/Frame 023870/0424 →
Assignment of Assignor's Interest Jan 29, 2010
From: DPAC TECHNOLOGIES CORP.
To: STAKTEK GROUP L.P.
Reel/Frame 023870/0245 →
Assignment of Assignor's Interest Jan 29, 2010
From: ISAAK, HARLAN R.
To: DENSE-PAC MICROSYSTEMS, INC.
Reel/Frame 023870/0372 →
Merger Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
Merger Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →
Assignment of Assignor's Interest Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Merger Dec 2, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029389/0544 →
Change of Name Dec 2, 2012
From: DENSE-PAC MICROSYSTEMS, INC.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 029395/0945 →
Merger Dec 5, 2012
From: ENTORIAN GP LLC; ENTORIAN LP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029412/0124 →
Merger Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →
Assignment of Assignor's Interest Mar 21, 2019
From: INTELLECTUAL VENTURES ASSETS 108 LLC
To: M-RED INC.
Reel/Frame 048662/0318 →
Assignment of Assignor's Interest Mar 22, 2019
From: TAMIRAS PER PTE. LTD., LLC
To: INTELLECTUAL VENTURES ASSETS 108 LLC
Reel/Frame 048680/0830 →
Assignment of Assignor's Interest Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest Feb 8, 2020
From: TAMIRAS PER PTE. LTD., LLC
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051856/0305 →