IP Library › Granted Patent US 6,627,984
Granted Patent Utility
US 6,627,984 · App. 09/912,010

Chip stack with differing chip package types

Inventors: Ted Bruce, John A. Forthun
Patented Case View Patent ↗
Granted: Sep 30, 2003 Filed: Jul 24, 2001
Inventors
Ted Bruce
John A. Forthun
Assignee (at issue)
Dense-Pac Microsystems, Inc.

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Quick Facts
Patent No.
US 6,627,984
App. No.
09/912,010
Filed
2001-07-24
Granted
2003-09-30
Kind
B2