IP Library › Assignment 023870/0424
Patent Assignment
Reel/Frame 023870/0424

Assignment of Assignor's Interest

Recorded: 2010-01-29 Pages: 4
Assignor
FORTHUN, JOHN A.
Executed: 2000-01-07
Assignee
DENSE-PAC MICROSYSTEMS, INC.
7321 LINCOLN WAY, GARDEN GROVE, CALIFORNIA, 92841
Covered Property (1)
Stackable Chip Package with Flex Carrier
Patent: 6,473,308 →
Application: 09/838,773 →
Publication: US 2001/0015487
Related Assignments (8)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 26, 2010
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 023848/0062 →
Assignment of Assignor's Interest Jan 29, 2010
From: DPAC TECHNOLOGIES CORP.
To: STAKTEK GROUP L.P.
Reel/Frame 023870/0245 →
Assignment of Assignor's Interest Jan 29, 2010
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.); DENSE-PAC MICROSYSTEMS, INC. (NOW KNOWN AS DPAC TECHNOLOGIES CORP.)
To: STAKTEK GROUP L.P.
Reel/Frame 023870/0297 →
Merger Dec 2, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029389/0544 →
Assignment of Assignor's Interest Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Change of Name Dec 2, 2012
From: DENSE-PAC MICROSYSTEMS, INC.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 029395/0945 →
Merger Dec 5, 2012
From: ENTORIAN GP LLC; ENTORIAN LP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029412/0124 →
Merger Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →