Patent Assignment
Reel/Frame 029395/0945
Change of Name
Recorded: 2012-12-02
Pages: 5
Assignor
DENSE-PAC MICROSYSTEMS, INC.
Executed: 2001-08-10
Assignee
DPAC TECHNOLOGIES CORP.
7321 LINCOLN WAY, GARDEN GROVE, CALIFORNIA, 92841
Covered Properties
(20)
Chip Stack and Method of Making Same
Patent:
5,612,570 →
Application:
08/421,801 →
Modular Panel Stacking Process
Patent:
5,869,353 →
Application:
08/971,499 →
Universal Package and Method of Forming the Same
Patent:
6,222,737 →
Application:
09/298,664 →
Stackable Flex Circuit Ic Package and Method of Making Same
Patent:
6,323,060 →
Application:
09/305,584 →
Stackable Chip Package with Flex Carrier
Patent:
6,262,895 →
Application:
09/482,294 →
Csp Stacking Technology Using Rigid/Flex Construction
Patent:
6,437,433 →
Application:
09/535,641 →
Stackable flex circuit chip package and method of making same
Patent:
6,351,029 →
Application:
09/574,321 →
Chip stack with active cooling system
Patent:
6,236,565 →
Application:
09/594,363 →
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Patent:
6,404,043 →
Application:
09/598,343 →
method of forming universal package
Patent:
6,360,433 →
Application:
09/664,938 →
Three-Dimensional Memory Stacking Using Anisotropic Epoxy Interconnections
Stackable Chip Package with Flex Carrier
Stackable Flex Circuit Chip Package and Method of Making Same
Stackable Flex Circuit Ic Package and Method of Making Same
Chip Stack with Differing Chip Package Types
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Post in Ring Interconnect Using for 3-D Stacking
Chip Stack with Differing Chip Package Types
Stackable Flex Circuit Ic Package and Method of Making Same
Patent:
39,628 →
Application:
10/900,073 →
Stackable Chip Package with Flex Carrier
Patent:
41,039 →
Application:
10/974,046 →
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger
Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →
Merger
Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
Change of Name
Dec 2, 2012
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 029395/0958 →
Assignment of Assignor's Interest
Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Assignment of Assignor's Interest
Dec 2, 2012
From: FORTHUN, JOHN A.
To: DENSE-PAC MICROSYSTEMS, INC.
Reel/Frame 029389/0548 →
Merger
Dec 2, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029389/0544 →
Merger
Dec 5, 2012
From: ENTORIAN GP LLC; ENTORIAN LP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029412/0124 →
Assignment of Assignor's Interest
Dec 5, 2012
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.)
To: STAKTEK GROUP L.P.
Reel/Frame 029412/0093 →
Merger
Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →
Assignment of Assignor's Interest
Mar 21, 2019
From: INTELLECTUAL VENTURES ASSETS 108 LLC
To: M-RED INC.
Reel/Frame 048662/0318 →
Assignment of Assignor's Interest
Mar 22, 2019
From: TAMIRAS PER PTE. LTD., LLC
To: INTELLECTUAL VENTURES ASSETS 108 LLC
Reel/Frame 048680/0830 →
Assignment of Assignor's Interest
Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest
Feb 8, 2020
From: TAMIRAS PER PTE. LTD., LLC
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051856/0305 →