IP Library › Assignment 029395/0958
Patent Assignment
Reel/Frame 029395/0958

Change of Name

Recorded: 2012-12-02 Pages: 4
Assignor
STAKTEK GROUP, L.P.
Executed: 2008-02-29
Assignee
ENTORIAN TECHNOLOGIES L.P.
4030 WEST BRAKER LANE, BUILDING 2-100, AUSTIN, TEXAS, 78759
Covered Properties (6)
Integrated Circuit Stacking System
Patent: 7,606,048 →
Application: 10/958,584 →
Publication: US 2005/0041402
Stackable Chip Package with Flex Carrier
Patent: 41,039 →
Application: 10/974,046 →
Flex-Based Circuit Module
Patent: 7,595,550 →
Application: 11/173,445 →
Publication: US 2005/0263872
Integrated Circuit Stacking System and Method
Patent: 7,524,703 →
Application: 11/221,597 →
Publication: US 2006/0008945
Circuit Module Having Force Resistant Construction
Patent: 7,804,985 →
Application: 12/197,674 →
Publication: US 2008/0308924
Carrier Structure Stacking System and Method
Patent: 7,675,155 →
Application: 12/262,927 →
Publication: US 2009/0072376
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →
Merger Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
Assignment of Assignor's Interest Dec 2, 2012
From: FORTHUN, JOHN A.
To: DENSE-PAC MICROSYSTEMS, INC.
Reel/Frame 029389/0548 →
Assignment of Assignor's Interest Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Change of Name Dec 2, 2012
From: DENSE-PAC MICROSYSTEMS, INC.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 029395/0945 →
Assignment of Assignor's Interest Dec 5, 2012
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.)
To: STAKTEK GROUP L.P.
Reel/Frame 029412/0093 →
Merger Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →