Patent Assignment
Reel/Frame 029389/0548
Assignment of Assignor's Interest
Recorded: 2012-12-02
Pages: 5
Assignor
FORTHUN, JOHN A.
Executed: 2000-01-07
Assignee
DENSE-PAC MICROSYSTEMS, INC.
7321 LINCOLN WAY, GARDEN GROVE, CALIFORNIA, 92841
Covered Property
(1)
Stackable Chip Package with Flex Carrier
Patent:
41,039 →
Application:
10/974,046 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →
Merger
Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
Assignment of Assignor's Interest
Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Change of Name
Dec 2, 2012
From: DENSE-PAC MICROSYSTEMS, INC.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 029395/0945 →
Change of Name
Dec 2, 2012
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 029395/0958 →
Assignment of Assignor's Interest
Dec 5, 2012
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.)
To: STAKTEK GROUP L.P.
Reel/Frame 029412/0093 →
Merger
Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →