IP Library › Assignment 048680/0830
Patent Assignment
Reel/Frame 048680/0830

Assignment of Assignor's Interest

Recorded: 2019-03-22 Pages: 5
Assignor
TAMIRAS PER PTE. LTD., LLC
Executed: 2019-02-22
Assignee
INTELLECTUAL VENTURES ASSETS 108 LLC
251 LITTLE FALLS DRIVE, WILMINGTON, DELAWARE, 19808
Covered Properties (9)
Method, Circuit and/or Architecture to Improve the Frequency Range of a Voltage Controlled Oscillator
Patent: 6,275,116 →
Application: 09/328,083 →
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Patent: 6,404,043 →
Application: 09/598,343 →
Stacking System and Method
Patent: 6,608,763 →
Application: 09/663,753 →
Three-Dimensional Memory Stacking Using Anisotropic Epoxy Interconnections
Patent: 6,472,735 →
Application: 09/826,621 →
Publication: US 2001/0054758
Chip Stack with Differing Chip Package Types
Patent: 6,627,984 →
Application: 09/912,010 →
Publication: US 2003/0020153
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Patent: 6,544,815 →
Application: 09/922,977 →
Publication: US 2001/0054770
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Patent: 6,566,746 →
Application: 10/017,553 →
Publication: US 2002/0053728
Chip Stack with Differing Chip Package Types
Patent: 6,908,792 →
Application: 10/263,859 →
Publication: US 2003/0025211
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Patent: 6,878,571 →
Application: 10/316,566 →
Publication: US 2003/0127746
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Jan 26, 2010
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 023848/0062 →
Assignment of Assignor's Interest Jan 29, 2010
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.); DENSE-PAC MICROSYSTEMS, INC. (NOW KNOWN AS DPAC TECHNOLOGIES CORP.)
To: STAKTEK GROUP L.P.
Reel/Frame 023870/0297 →
Assignment of Assignor's Interest Jan 29, 2010
From: DPAC TECHNOLOGIES CORP.
To: STAKTEK GROUP L.P.
Reel/Frame 023870/0245 →
Assignment of Assignor's Interest Jan 29, 2010
From: ISAAK, HARLAN R.
To: DENSE-PAC MICROSYSTEMS, INC.
Reel/Frame 023870/0421 →
Release of Security Interest Feb 26, 2010
From: COMERICA BANK, AS AGENT
To: STAKTEK GROUP L.P. NOW KNOWN AS ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 023985/0954 →
Assignment of Assignor's Interest Oct 8, 2012
From: CYPRESS SEMICONDUCTOR CORPORATION
To: TORREFY CONSULTING LLC
Reel/Frame 029089/0427 →
Merger Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →
Merger Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
Assignment of Assignor's Interest Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Change of Name Dec 2, 2012
From: DENSE-PAC MICROSYSTEMS, INC.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 029395/0945 →
Merger Dec 15, 2015
From: TORREFY CONSULTING LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037297/0786 →
Merger Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →
Assignment of Assignor's Interest Mar 21, 2019
From: INTELLECTUAL VENTURES ASSETS 108 LLC
To: M-RED INC.
Reel/Frame 048662/0318 →