Patent Assignment
Reel/Frame 048662/0318
Assignment of Assignor's Interest
Recorded: 2019-03-21
Pages: 7
Assignor
INTELLECTUAL VENTURES ASSETS 108 LLC
Executed: 2019-03-15
Assignee
M-RED INC.
1601 ELM ST., SUITE 4360, DALLAS, TEXAS, 75201
Covered Properties
(22)
Method, Circuit and/or Architecture to Improve the Frequency Range of a Voltage Controlled Oscillator
Patent:
6,275,116 →
Application:
09/328,083 →
Fabrication Method for Gate Spacer
Patent:
6,194,279 →
Application:
09/340,929 →
Bond Pad Structure and Its Method of Fabricating
Patent:
6,365,970 →
Application:
09/458,778 →
Electrostatic discharge protection circuit
Patent:
6,281,554 →
Application:
09/531,905 →
Apparatus for Reducing an Electrical Noise Inside a Ball Grid Array Package
Patent:
6,509,646 →
Application:
09/575,637 →
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Patent:
6,404,043 →
Application:
09/598,343 →
Method of Programming Plds Using a Wireless Link
Patent:
6,912,601 →
Application:
09/605,325 →
Stacking System and Method
Patent:
6,608,763 →
Application:
09/663,753 →
Apparatus and Method for an Improved Performance Vliw Processor
Method and Apparatus for Convolution Encoding and Viterbi Decoding of Data That Utilize a Configurable Processor to Configure a Plurality of Re-Configurable Processing Elements
Three-Dimensional Memory Stacking Using Anisotropic Epoxy Interconnections
Method of Manufacturing a Semiconductor Device
Control Signal Generator for an Overvoltage-Tolerant Interface Circuit on a Low Voltage Process
Patent:
6,496,054 →
Application:
09/852,185 →
Mos Transistors Having Dual Gates and Self-Aligned Interconnect Contact Windows
Chip Stack with Differing Chip Package Types
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Micro Controller Development System
Clock and Data Recovery with a Feedback Loop to Adjust the Slice Level of an Input Sampling Circuit
Digitally Controlled Crystal Oscillator with Integrated Coarse and Fine Control
Chip Stack with Differing Chip Package Types
Panel Stacking of Bga Devices to Form Three-Dimensional Modules
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 24, 2012
From: SILICON LABORATORIES INC.
To: MANZE PROPERTIES LLC
Reel/Frame 028625/0669 →
Corrective Assignment to Correct the Execution Date of David M. Pietruszynski Listed on the Recordation Cover Sheet to 07/23/2002 Previously Recorded on Reel 013159 Frame 0418. Assignor(S) Hereby Confirms the Assignment.
Jul 25, 2012
From: PIETRUSZYNSKI, DAVID M.; FREY, DOUGLAS R.
To: SILICON LABORATORIES, INC.
Reel/Frame 028640/0030 →
Assignment of Assignor's Interest
Oct 8, 2012
From: CYPRESS SEMICONDUCTOR CORPORATION
To: TORREFY CONSULTING LLC
Reel/Frame 029089/0427 →
Merger
Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →
Merger
Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
Assignment of Assignor's Interest
Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Change of Name
Dec 2, 2012
From: DENSE-PAC MICROSYSTEMS, INC.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 029395/0945 →
Release of Security Interest
Nov 5, 2014
From: US BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: VITESSE SEMICONDUCTOR CORPORATION
Reel/Frame 034176/0162 →
Merger
Sep 29, 2015
From: SOKIA MGMT. LIMITED LIABILITY COMPANY
To: CALLAHAN CELLULAR L.L.C.
Reel/Frame 036711/0530 →
Merger
Nov 19, 2015
From: MANZE PROPERTIES LLC
To: XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY
Reel/Frame 037092/0756 →
Merger
Dec 15, 2015
From: TORREFY CONSULTING LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037297/0786 →
Merger
Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →
Merger
Dec 31, 2015
From: FINLASIN TECHNOLOGY LLC
To: NYTELL SOFTWARE LLC
Reel/Frame 037392/0653 →
Merger
Dec 31, 2015
From: QUALTENSE MGMT. L.L.C.
To: NYTELL SOFTWARE LLC.
Reel/Frame 037392/0851 →
Merger
Jan 11, 2016
From: SCHULKORT TRIO LIMITED LIABILITY COMPANY
To: CALLAHAN CELLULAR L.L.C.
Reel/Frame 037471/0710 →
Merger
Jan 29, 2016
From: INTELLECTUAL VENTURES FUND 74 LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 037625/0564 →
Corrective Assignment to Correct the Receiving Party and Execution Dates Previously Recorded at Reel: 016863 Frame: 0843. Assignor(S) Hereby Confirms the Release of Security Agreement.
Feb 1, 2019
From: SMART TECHNOLOGY VENTURES III SBIC, L.P.; BRIDGEWEST, LLC; ELLUMINA, LLC; AMIRRA INVESTMENTS LTD.
To: MORPHO TECHNOLOGIES
Reel/Frame 048210/0534 →
Assignment of Assignor's Interest
Mar 21, 2019
From: CALLAHAN CELLULAR L.L.C.
To: INTELLECTUAL VENTURES ASSETS 108 LLC
Reel/Frame 048666/0844 →
Assignment of Assignor's Interest
Mar 22, 2019
From: CHANG LIAO HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 108 LLC
Reel/Frame 048680/0865 →
Assignment of Assignor's Interest
Mar 22, 2019
From: XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY
To: INTELLECTUAL VENTURES ASSETS 108 LLC
Reel/Frame 048680/0835 →
Assignment of Assignor's Interest
Mar 22, 2019
From: TAMIRAS PER PTE. LTD., LLC
To: INTELLECTUAL VENTURES ASSETS 108 LLC
Reel/Frame 048680/0830 →
Assignment of Assignor's Interest
Mar 22, 2019
From: NYTELL SOFTWARE LLC
To: INTELLECTUAL VENTURES ASSETS 108 LLC
Reel/Frame 048680/0705 →
Assignment of Assignor's Interest
Mar 22, 2019
From: INTELLECTUAL VENTURES II LLC
To: INTELLECTUAL VENTURES ASSETS 108 LLC
Reel/Frame 048680/0226 →
Assignment of Assignor's Interest
Mar 22, 2019
From: INTELLECTUAL VENTURES HOLDING 81 LLC
To: INTELLECTUAL VENTURES ASSETS 108 LLC
Reel/Frame 048679/0690 →
Assignment of Assignor's Interest
Mar 22, 2019
From: TAICHI HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 108 LLC
Reel/Frame 048680/0946 →