Patent Assignment
Reel/Frame 048680/0946
Assignment of Assignor's Interest
Recorded: 2019-03-22
Pages: 3
Assignor
TAICHI HOLDINGS, LLC
Executed: 2019-02-25
Assignee
INTELLECTUAL VENTURES ASSETS 108 LLC
251 LITTLE FALLS DRIVE, WILMINGTON, DELAWARE, 19808
Covered Properties
(2)
Bond Pad Structure and Its Method of Fabricating
Patent:
6,365,970 →
Application:
09/458,778 →
Apparatus for Reducing an Electrical Noise Inside a Ball Grid Array Package
Patent:
6,509,646 →
Application:
09/575,637 →
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.