Patent Assignment
Reel/Frame 029412/0124
Merger
Recorded: 2012-12-05
Pages: 4
Assignee
ENTORIAN TECHNOLOGIES INC.
4030 W. BRAKER LANE, BLDG 2-100, AUSTIN, TEXAS, 78759
Covered Property
(1)
Stackable Chip Package with Flex Carrier
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jan 26, 2010
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 023848/0062 →
Assignment of Assignor's Interest
Jan 29, 2010
From: FORTHUN, JOHN A.
To: DENSE-PAC MICROSYSTEMS, INC.
Reel/Frame 023870/0424 →
Assignment of Assignor's Interest
Jan 29, 2010
From: DPAC TECHNOLOGIES CORP.
To: STAKTEK GROUP L.P.
Reel/Frame 023870/0245 →
Assignment of Assignor's Interest
Jan 29, 2010
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.); DENSE-PAC MICROSYSTEMS, INC. (NOW KNOWN AS DPAC TECHNOLOGIES CORP.)
To: STAKTEK GROUP L.P.
Reel/Frame 023870/0297 →
Merger
Dec 2, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029389/0544 →
Assignment of Assignor's Interest
Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Change of Name
Dec 2, 2012
From: DENSE-PAC MICROSYSTEMS, INC.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 029395/0945 →
Merger
Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →