Granted Patent
Utility
US 6,473,308
· Confirmation No. 2933
STACKABLE CHIP PACKAGE WITH FLEX CARRIER
Inventor:
John A. Forthun
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2007-04-12 | PA.. |
Power of Attorney | 10 | View | |
| 2007-04-12 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2001-04-19 | TRNA |
Transmittal of New Application | 3 | View | |
| 2001-04-19 | ADS |
Application Data Sheet | 2 | View | |
| 2001-04-19 | SPEC |
Specification | 16 | View | |
| 2001-04-19 | CLM |
Claims | 5 | View | |
| 2001-04-19 | ABST |
Abstract | 1 | View | |
| 2001-04-19 | DRW |
Drawings-only black and white line drawings | 3 | View | |
| 2001-04-19 | OATH |
Oath or Declaration filed | 10 | View |
Inventors
John A. Forthun
Glendora, CA
Attorneys & Agents of Record
Classification
USPC
361/749
H10W70/688
H10W90/00
H10W72/801
H10W90/288
H10W70/60
Prosecution
- Examiner
- HYEON, HAE M
- Art Unit
- 2839
- Customer No.
- 7663
- Docket No.
- DENSE-003C
- Confirmation No.
- 2933
Publication
- Pub. No.
- US20010015487A1
- Pub. Date
- 2001-08-23
Patent Term Adjustment
-44days
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2012-12-02
from
FORTHUN, JOHN A.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2010-01-29
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2010-01-29
from
DENSE-PAC MICROSYSTEMS, INC. (NOW KNOWN AS DPAC TECHNOLOGIES CORP.),
DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2010-01-29
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2004-06-25
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Quick Facts
- Patent No.
- US 6,473,308
- App. No.
- 09/838,773
- Filed
- 2001-04-19
- Granted
- 2002-10-29
- Pub. No.
- US20010015487A1
- Examiner
- HYEON, HAE M
- Art Unit
- 2839
- PTA
- -44 days
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