Patent Assignment
Reel/Frame 029389/0544
Merger
Recorded: 2012-12-02
Pages: 4
Assignor
ENTORIAN TECHNOLOGIES L.P.
Executed: 2010-07-14
Assignee
ENTORIAN GP LLC
4030 W. BRAKER LANE, AUSTIN, TEXAS, 78759
Covered Property
(1)
Stackable Chip Package with Flex Carrier
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jan 26, 2010
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 023848/0062 →
Assignment of Assignor's Interest
Jan 29, 2010
From: FORTHUN, JOHN A.
To: DENSE-PAC MICROSYSTEMS, INC.
Reel/Frame 023870/0424 →
Assignment of Assignor's Interest
Jan 29, 2010
From: DPAC TECHNOLOGIES CORP.
To: STAKTEK GROUP L.P.
Reel/Frame 023870/0245 →
Assignment of Assignor's Interest
Jan 29, 2010
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.); DENSE-PAC MICROSYSTEMS, INC. (NOW KNOWN AS DPAC TECHNOLOGIES CORP.)
To: STAKTEK GROUP L.P.
Reel/Frame 023870/0297 →
Assignment of Assignor's Interest
Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Change of Name
Dec 2, 2012
From: DENSE-PAC MICROSYSTEMS, INC.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 029395/0945 →
Merger
Dec 5, 2012
From: ENTORIAN GP LLC; ENTORIAN LP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029412/0124 →
Merger
Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →