Patent Assignment
Reel/Frame 023870/0372
Assignment of Assignor's Interest
Recorded: 2010-01-29
Pages: 2
Assignor
ISAAK, HARLAN R.
Executed: 1999-04-28
Assignee
DENSE-PAC MICROSYSTEMS, INC.
7321 LINCOLN WAY, GARDEN GROVE, CALIFORNIA, 92641
Covered Properties
(2)
Stackable Flex Circuit Ic Package and Method of Making Same
Patent:
6,426,549 →
Application:
09/706,015 →
Stackable Flex Circuit Ic Package and Method of Making Same
Patent:
39,628 →
Application:
10/900,073 →
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Jan 26, 2010
From: STAKTEK GROUP, L.P.
To: ENTORIAN TECHNOLOGIES L.P.
Reel/Frame 023848/0062 →
Assignment of Assignor's Interest
Jan 29, 2010
From: DPAC TECHNOLOGIES CORP.
To: STAKTEK GROUP L.P.
Reel/Frame 023870/0245 →
Assignment of Assignor's Interest
Jan 29, 2010
From: DPAC TECHNOLOGIES CORP. (FORMERLY KNOWN AS DENSE-PAC MICROSYSTEMS, INC.); DENSE-PAC MICROSYSTEMS, INC. (NOW KNOWN AS DPAC TECHNOLOGIES CORP.)
To: STAKTEK GROUP L.P.
Reel/Frame 023870/0297 →
Merger
Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →
Merger
Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
Change of Name
Dec 2, 2012
From: DENSE-PAC MICROSYSTEMS, INC.
To: DPAC TECHNOLOGIES CORP.
Reel/Frame 029395/0945 →
Assignment of Assignor's Interest
Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
Merger
Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →