Patent Assignment
Reel/Frame 014032/0305
Change of Name
Recorded: 2003-05-06
Received: 2003-05-08
Pages: 4
Assignee
DPAC TECHNOLOGIES, INC.
7321 LINCOLN WAY, GARDEN GROVE, CA, 92841, UNITED STATES
Covered Property
(1)
Method of Assembling a Stackable Integrated Circuit Chip
Application:
10/202,185 →