Granted Patent
Utility
US 5,566,051 · App. 08/298,544
Ultra high density integrated circuit packages method and apparatus
Inventor:
Carmen D. Burns
Patented Case
View Patent ↗
Granted: Oct 15, 1996
Filed: Aug 30, 1994
Inventor
Carmen D. Burns
Assignee (at issue)
Staktek Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.