High capacity thin module system and method
View Patent ↗Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers, are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flexible circuit may exhibit one or two more conductive layers, and may have changes in the layered structure of have split layers. Other embodiments may stagger or offset the ICs or include greater numbers of ICs.
1. A circuit module comprising:
a flex circuit having a first side and a second side and first and second perimeter edges and plural contacts along the first side adapted for connection to an edge connector socket;
a first plurality of integrated circuits and a first buffer circuit disposed along the first side of the flex circuit and a second plurality of integrated circuits disposed on the first side of the flex circuit;
a single rigid substrate supporting the circuit module having first and second opposing lateral sides and first and second substrate perimeter edges, the flex circuit being disposed about the first substrate perimeter edge so as to place the plural contacts of the flex circuit facing outward away from the substrate but proximal to the first substrate perimeter edge, the second plurality of integrated circuits disposed along the second side of the flex circuit between the flex circuit and the rigid substrate and the first plurality of integrated circuits and first buffer circuit disposed along the first side of the flex circuit facing outward away from the substrate and the flex circuit being disposed so as to place the first and second flex perimeter edges closer to the second substrate perimeter edge than the first substrate perimeter edge.
2. The circuit module of claim 1 further comprising a second buffer circuit disposed on the second side of the flex circuit.
3. The circuit module of claim 1 in which the single rigid substrate is patterned to provide at least one cutaway area into which is disposed at least one integrated circuit of the second plurality of integrated circuits.
4. The circuit module of claim 1 in which a FB-DIMM instantiation is comprised of the first plurality of integrated circuits and the buffer circuit.
5. The circuit module of claim 1 in which a DIMM instantiation is comprised of the first and second pluralities of integrated circuits.
6. The circuit module of claim 1 in which a DIMM instantiation is comprised of the first plurality of integrated circuits and the buffer circuit.
7. The circuit module of claim 1 in which the first buffer circuit is an advanced memory buffer (AMB).
8. The circuit module of claim 1 in which the first plurality of integrated circuits are comprised of memory circuits.