Managed memory component
View Patent ↗The present invention provides a system and method for combining a leaded package IC and a semiconductor die using a flex circuitry to reduce footprint for the combination. A leaded IC package is disposed along the obverse side of a flex circuit. In a preferred embodiment, leads of the leaded IC package are configured to allow the lower surface of the body of the leaded IC package to contact the surface of the flex circuitry either directly or indirectly through an adhesive. A semiconductor die is connected to the reverse side of the flex circuit. In one embodiment, the semiconductor die is disposed on the reverse side of the flex while, in an alternative embodiment, the semiconductor die is disposed into a window in the flex circuit to rest directly or indirectly upon the body of the leaded IC package. Module contacts are provided in a variety of configurations. In a preferred embodiment, the leaded IC package is a flash memory and the semiconductor die is a controller.
1. A circuit module comprising:
flex circuitry having first and second sides, the flex circuitry having a plurality of leaded IC pads adapted for connection of a leaded packaged IC, the second side having an array of module contacts and plural flex pads;
a semiconductor die disposed on the second side of the flex circuitry, the semiconductor die being connected to the flex circuitry;
a leaded packaged IC having a body and upper and lower major surfaces, plural peripheral sides, and leads emergent from at least a first one of the plural peripheral sides of the leaded packaged IC, the leads being connected to the plurality of leaded IC pads of the flex circuitry and the lower major surface of the leaded packaged IC contacting the first side of the flex circuitry, the flex circuitry being folded about the body of the leaded packaged IC to place the semiconductor die closer to the lower major side than the upper major side of the leaded packaged IC.
2. The circuit module of claim 1 in which the leads are connected to the leaded IC pads which are disposed on the first side of the flex circuitry.
3. The circuit module of claim 1 in which the leads are connected to the leaded IC pads which are disposed on the second side of the flex circuitry.
4. The circuit module of claim 1 in which the leads pass through the flex circuitry.
5. The circuit module of claim 1 in which the leads are parallel to the lower major surface of the leaded packaged IC.
6. The circuit module of claim 1 in which the leads pass through lead holes in the flex circuitry to contact the leaded IC pads which are disposed on the second side of the flex circuitry.
7. The circuit module of claim 1 in which the flex circuitry further comprises a deflected area that bears the plurality of leaded IC pads.
8. The circuit module of claim 1 in which the flex circuitry further comprises a deflected area that is deflected toward the body of the leaded packaged IC.
9. The circuit module of claim 1 in which the flex circuitry has at least one distal end that contacts an inner side of one of the leads of the leaded packaged IC.
10. The circuit module of claim 1 in which an adhesive is disposed between the lower major surface of the leaded packaged IC and the first side of the flex circuitry.
11. The circuit module of claim 1 in which the leads of the leaded packaged IC have been configured to be confined to a space defined by first and second planes defined by the upper and lower major surfaces of the leaded packaged IC.
12. The circuit module of claim 1 in which the leaded packaged IC is a flash memory device.
13. The circuit module of claim 1 in which the semiconductor die is a controller.
14. The circuit module of claim 1 in which the leaded packaged IC is flash memory circuit in TSOP packaging.
15. The circuit module of claim 1 in which the connection of the semiconductor die with the flex circuitry is realized with wire bonds.
16. The circuit module of claim 1 in which the semiconductor die is encapsulated.
17. The circuit module of claim 1 in which the connection of the semiconductor die with the flex circuitry is realized with wire bonds between die pads of the semiconductor die and the flex pads of the flex circuitry.
18. A circuit module comprising:
flex circuitry having first and second sides, the first side having a plurality of leaded IC pads adapted for connection of a leaded packaged IC, the second side having an array of module contacts and plural flex pads;
a semiconductor die disposed on the flex circuitry and connected to the flex pads; and
a leaded packaged IC having a body and upper and lower major surfaces, plural peripheral sides, and leads emergent from at least a first one of the plural peripheral sides of the leaded packaged IC, the leads being connected to the plurality of leaded IC pads of the first side of the flex circuitry and configured to be confined to a space defined by first and second planes defined by the upper and lower major surfaces of the leaded packaged IC so that the lower major surface of the leaded packaged IC contacts the first side of the flex circuitry, the flex circuitry being folded about the body of the leaded packaged IC to place the flex circuitry bearing the semiconductor die over and proximal to the lower major surface of the leaded packaged IC.
19. The circuit module of claim 18 in which the semiconductor die is a controller.
20. The circuit module of claim 18 in which the leaded packaged IC is a flash memory device.
21. The circuit module of claim 18 in which the contact of the lower major surface of the leaded packaged IC and the semiconductor die is effectuated with an adhesive disposed between the lower major surface of the leaded packaged IC and the first side of the flex circuitry.
22. The circuit module of claim 18 in which the semiconductor die has a face with semiconductor die pads and that face is turned away from the lower major surface of the leaded packaged IC.
23. The circuit module of claim 18 in which there is adhesive between the upper and lower major surfaces of the leaded packaged IC and the flex circuitry.
24. The circuit module of claim 18 in which the leaded packaged IC is a flash memory device and the semiconductor die is a controller.
25. The circuit module of claim 18 in which the semiconductor die is encapsulated.
26. The circuit module of claim 18 in which the semiconductor die is attached to the flex pads with wire bonds.
27. The circuit module of claim 26 in which the wire bonds are protected by encapsulate.