Stacking system and method
View Patent ↗A chip stack comprising a flex circuit including a flex substrate having a first conductive pattern disposed thereon and a plurality of leads extending therefrom. Also included in the chip stack are at least two integrated circuit chip packages. The integrated circuit chip packages may be electrically connected to the first conductive pattern of the flex circuit such that the integrated circuit chip packages are positioned upon respective ones of opposed top and bottom surfaces of the flex substrate. Alternatively, one of the integrated circuit chip packages may be positioned upon the top surface of the flex substrate and electrically connected to the first conductive pattern, with the remaining integrated circuit chip package being attached in a non-conductive manner to the bottom surface of the flex substrate such that the conductive contacts of such integrated circuit chip package and the leads collectively define a composite footprint for the chip stack.
1. A chip stack comprising:
a flex circuit comprising:
a flex substrate;
a first conductive pattern disposed on the flex substrate; and
a plurality of flex pads electrically connected to the first conductive pattern;
two integrated circuit devices electrically connected to the first conductive pattern and disposed one above the other.
2. The chip stack of claim 1 in which the two integrated circuit devices are disposed on opposite sides of the flex substrate.
3. The chip stack of claim 1 in which conductive contacts of a first one of the two integrated circuit devices are attached to the plurality of flex pads.
4. The chip stack of claim 1 in which the first conductive pattern comprises a first set of flex pads and a second set of flex pads.
5. The chip stack of claim 1 in which a first one of the two integrated circuit devices is a flip-chip device.
6. The chip stack of claim 1 in which the conductive contacts of a first one of the two integrated circuit devices are BGA contacts.