Modularized die stacking system and method
View Patent ↗An IC die and a flexible circuit structure are integrated into a lower stack element that can be stacked with either further integrated lower stack element iterations or with pre-packaged ICs in any of a variety of package types. The present invention may be employed to stack similar or dissimilar integrated circuits and may be used to create modularized systems. In a preferred embodiment, a die is positioned above the surface of portions of a pair of flex circuits. Connection is made between the die and the flex circuitry. A protective layer such as a molded plastic, for example, is formed to protect the flex-connected die and its connection to the flex. Connective elements are placed along the flex circuitry to create an array of module contacts along the second side of the flex circuitry. The flex circuitry is positioned above the body-protected die to create an integrated lower stack element. The integrated lower stack element may be stacked either with iterations of the integrated lower stack element or with a pre-packaged IC to create a multi-element stacked circuit module.
1. A circuit module comprising:
(a) an integrated lower stack element comprising;
an integrated circuit die having a plurality of die connective sites;
a flexible circuit having first and second conductive layers, the flexible circuit being disposed in part beneath and affixed to and connected with the integrated circuit die to form a die-flex combination; and
a protective structure set about the die-flex combination to cover at least a portion of the die and at least a portion of the flexible circuit and create a body having an upper surface above which are placed portions of the flexible circuit; and
(b) an upper IC element having a plurality of upper IC contacts, the upper IC element being disposed in stacked conjunction with the integrated lower stack element, the upper IC element and integrated lower stack element being connected through the flexible circuit;
wherein the flexible circuit further comprises:
an intermediate layer between the first and second conductive layers, the second conductive layer having demarked first and second flex contacts, the second flex contacts being accessible through windows formed through the first conductive layer, and the intermediate layer, the first flex contacts in electrical connection with the upper IC element and the second flex contacts in electrical connection with the integrated circuit die.
2. The circuit module of claim 1 in which a data signal connection between the upper IC element and the integrated lower stack element is implemented at the second conductive layer of the flex circuit.
3. The circuit module of claim 1 in which a data signal connection between the upper IC element and the integrated lower stack element is implemented at the first conductive layer of the flex circuit.
4. The circuit module of claim 1 in which:
a data set of the plurality of upper IC contacts expresses an n-bit datapath;
a data set of the plurality of die connective sites expresses an n-bit datapath; and
a set of module contacts expresses a 2n-bit datapath that combines the n-bit datapath of the data set of the plurality of upper IC contacts and the n-bit datapath of the data set of the plurality of die connective sites.
5. The circuit module of claim 1 in which the second conductive layer comprises at least one demarked voltage plane and a voltage set of upper flex contacts and a voltage set of lower flex contacts that connect voltage conductive die connective sites and voltage conductive upper IC contacts to one of the at least one voltage planes.
6. A flex circuit connecting an upper IC element and an integrated circuit die, in a circuit module, the flex circuit comprising:
first and second outer layers; and
first and second conductive layers, between which there is an intermediate layer, the first and second conductive layers and the intermediate layer being interior to the first and second outer layers, the second conductive layer having demarked first and second flex contacts, the first flex contacts being accessible through first windows through the second outer layer and the second flex contacts being accessible through second windows through the first outer layer, the first conductive layer, and the intermediate layer, the first flex contacts in electrical connection with the upper IC element and the second flex contacts in electrical connection with the integrated circuit die;
wherein the flex circuit is disposed in part beneath and is combined with the integrated circuit die to form a die-flex combination and wherein a protective structure is set about the die-flex combination to cover at least a portion of the die and at least a portion of the flex circuit, the protective structure having an upper surface above which are placed portions of the flex circuit.
7. The flex circuit of claim 6 in which the second flex contacts are accessible through module windows through the second outer layer.
8. The flex circuit of claim 6 in which the first and second conductive layers are metal.
9. The flex circuit of claim 8 in which the metal of the first and second conductive layers is alloy 110 .
10. The flex circuit of claim 6 in which selected ones of the first flex contacts are connected to selected ones of the second flex contacts.
11. The flex circuit of claim 10 in which the connected selected ones of the first and second flex contacts are connected with traces.
12. The flex circuit of claim 6 in which selected ones of the first flex contacts and selected ones of the second flex contacts are connected to the first conductive layer.
13. The flex circuit of claim 6 in which selected ones of the first flex contacts and selected ones of the second flex contacts are connected to the first conductive layer with vias.
14. A circuit module that employs the flex circuit of claim 6 to connect selected die contacts of an integrated circuit die to selected contacts of an upper IC element.