Stacked module systems and method
View Patent ↗A combination composed from a form standard and a CSP is attached to flex circuitry. Solder paste is applied to first selected locations on the flex circuitry and adhesive is applied to second selected locations on the flex circuitry. The flex circuitry and the combination of the form standard and CSP are brought into proximity with each other. During solder reflow operation, a force is applied that tends to bring the combination and flex circuitry closer together. As the heat of solder reflow melts the contacts of the CSP, the combination collapses toward the flex circuitry displacing the adhesive as the solder paste and contacts merge into solder joints. In a preferred embodiment, the form standard will be devised of heat transference material, a metal, for example, such as copper would be preferred, to improve thermal performance. In other embodiments, the methods of the invention may be used to attach a CSP without a form standard to flex circuitry.
1. A method for devising a high-density circuit module, the method comprising the steps of:
providing a first CSP having contacts;
providing flex circuitry;
disposing the first CSP and the flex circuitry in proximity to each other; and
applying a force to move the first CSP toward the flex circuitry during a solder reflow operation.
2. The method of claim 1 in which the step of applying force to move the first CSP toward the flex circuitry comprises placing a weight on the first CSP.
3. The method of claim 1 in which the step of applying force to move the first CSP toward the flex circuitry comprises applying a downward force on the first CSP with a fixture while the flex circuitry is supported from beneath.
4. The method of claim 1 in which the flex circuitry comprises at least two conductive layers.
5. The method of claim 1 further comprising the steps of:
providing a second CSP;
disposing the second CSP above the first CSP; and
connecting the first and second CSPs with the flex circuitry.
6. The method of claim 5 in which the flex circuitry comprises at least two conductive layers.
7. A high-density circuit module devised in accordance with the method of claim 1 .
8. A method for devising a high-density circuit module, the method comprising the steps of:
providing a first CSP having a planar surface rising above which are contacts;
providing a flex circuit upon which is located solder paste at first selected sites and adhesive at second selected sites;
disposing the first CSP adjacent to the flex circuit to realize areas of contact between the contacts and the first selected sites;
applying a force to the first CSP during a solder reflow operation to move the first CSP and flex circuit closer together while displacing the adhesive.
9. The method of claim 8 in which the flex circuit comprises two conductive layers.
10. The method of claim 9 in which the displaced adhesive cures after the solder reflow operation.
11. The method of claim 8 further comprising the step of disposing a second CSP above the first CSP and connecting the flex circuit to the second CSP.
12. The method of claim 11 in which the flex circuit comprises two conductive layers.
13. The method of claim 12 in which the displaced adhesive cures after the solder reflow operation.
14. A method for devising a high-density circuit module, the method comprising the steps of:
providing a first CSP having a first major surface and a second major surface along which are disposed contacts;
providing a flex circuit having a first end portion;
disposing the first CSP and the flex circuit in proximity to each other;
applying a force to move the first CSP toward the flex circuitry;
performing a solder reflow operation to connect the contacts of the first CSP to the flex circuit; and
disposing the first end portion of the flex circuit along at least a first portion of the first major surface of the first CSP.
15. The method of claim 14 further comprising the step of attaching the first end portion of the flex circuit to at least part of the first portion of the first major surface of the first CSP with adhesive.
16. The method of claim 14 in which the flex circuit further comprises a second end portion, and the method further comprises the step of disposing the second end portion of the flex circuit along at least a second portion of the first major surface of the first CSP.
17. The method of claim 16 further comprising the steps of:
attaching the first end portion of the flex circuit to at least part of the first portion of the first major surface of the first CSP with adhesive; and
attaching the second end portion of the flex circuit to at least part of the second portion of the first major surface of the first CSP with adhesive.
18. The method of claim 14 further comprising the steps of:
disposing a second CSP in a stacked configuration with the first CSP; and
connecting the second CSP to the first end portion of the flex circuit.
19. The method of claim 15 further comprising the steps of:
disposing a second CSP in a stacked configuration with the first CSP; and
connecting the second CSP to the first end portion of the flex circuit.
20. The method of claim 16 further comprising the steps of:
disposing a second CSP in a stacked configuration with the first CSP;
connecting the second CSP to the first end portion of the flex circuit; and
connecting the second CSP to the second end portion of the flex circuit.
21. The method of claim 17 further comprising the steps of:
disposing a second CSP in a stacked configuration with the first CSP;
connecting the second CSP to the first end portion of the flex circuit; and
connecting the second CSP to the second end portion of the flex circuit.